Chip manufacturing method and product

The invention relates to the field of chip manufacturing, in particular to manufacturing of a superconducting integrated circuit used in a quantum computer. A convex alignment structure and a concave alignment structure are disposed on the surfaces of the two substrates such that the convex alignment structure and the concave alignment structure extend within the concave alignment structure to a maximum depth determined by the geometry of the alignment structures. The alignment structure acts as a hard stop for positioning and aligning a substrate for flip chip bonding. 本发明设计芯片制造领域，具体地设计用于量子计算机中的超导集成电路的制造。凸起对准结构和凹入对准结构设置在两个基板的表面上，使得所述凸起对准结构和凹入对准结构在所述凹入对准结构内延伸到由对准结构的几何形状确定的最大深度。所述对准结构充当硬止挡件，用于定位和对准用于倒装芯片接合的基板。