Heterogeneous multilayer structure

Systems, methods, and devices disclosed herein relate to multilayer structures arranged in a vertical orientation. In some embodiments, a computing component may include a first cooling system, a first electronics layer, a second cooling system, and a second electronics layer. The first cooling system may be disposed on top of the first electronics layer and may be in thermal communication with the first electronics layer. The first electronic device layer array includes an array of integrated circuit dies in electronic communication with each other in a plane orthogonal to the power transfer. The first electronics layer may be disposed on top of and may be in thermal communication with the second cooling system, and the second cooling system may be disposed on top of and may be in thermal communication with the second electronics layer. The second electronics layer includes an array of power transfer modules. In some embodiments, at least one layer may be packaged using a system-on-chip. 本文公开的系统、方法和装置涉及以竖直取向