Method for producing solder particles, solder particles, and conductive composition

Provided is a method for producing solder particles, comprising a curing step for curing solder particles such that the hardness K value at 70% compressive deformation becomes 850 N/mm2 or more and 1,500 N/mm2 or less, and a grading step for forcibly generating an air flow by a grading device and gr...

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Bibliographische Detailangaben
Hauptverfasser:	NISHIO TAKESHI, YAMAGUCHI, SARI, NAMIKI HIDETSUGU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ALLOYS CASTING CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY OTHER SEPARATING BY DRY METHODS APPLICABLE TO BULK MATERIAL,e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL PERFORMING OPERATIONS POWDER METALLURGY SEPARATING SOLIDS FROM SOLIDS SEPERATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, ORSIFTING OR BY USING GAS CURRENTS SOLDERING OR UNSOLDERING SORTING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	Provided is a method for producing solder particles, comprising a curing step for curing solder particles such that the hardness K value at 70% compressive deformation becomes 850 N/mm2 or more and 1,500 N/mm2 or less, and a grading step for forcibly generating an air flow by a grading device and grading the cured solder particles. 提供一种焊料粒子的制造方法，其包括：将焊料粒子以使70％压缩变形时的硬度K值成为850N/mm2以上1,500N/mm2以下的方式进行固化的固化工序，通过分级装置使气流强制地产生，将固化后的焊料粒子进行分级的分级工序。