Temperature sampling method and sampling circuit of single-tube packaging power device

The invention discloses a temperature sampling method and sampling circuit for a single-tube packaging power device. The temperature sampling method comprises the following steps: a copper bar pin and an IGBT pin of bus input or three-phase output are fixedly contacted on a structural board PCB and then welded together; the NTC is welded on the structural board PCB, and the welding position of the NTC is close to the collector pin of the IGBT but does not contact the collector pin of the IGBT; a groove is formed between the NTC and a collector electrode pin of the IGBT, and meanwhile the groove is filled with high-thermal-conductivity glue with the insulating property; the NTC is connected to the main control board and is connected with the sampling circuit for non-isolated temperature acquisition. According to the invention, the sampling point is close to the collector pin of the IGBT, but not in contact with the collector pin, the groove between the collector pin and the NTC is filled with the high-density