Resin composition and electronic component

The present invention provides a resin composition, which comprises a modified maleimide resin. The modified maleimide resin is formed by carrying out condensation polymerization reaction on dicyclopentadiene resin with amido and maleic anhydride, wherein the dicyclopentadiene resin with amido is fo...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIU JIALIN, HUANG WEIRU, LIU YUTING, LIAO DECHAO, ZHANG HONGYI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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