Resin composition and electronic component
The present invention provides a resin composition, which comprises a modified maleimide resin. The modified maleimide resin is formed by carrying out condensation polymerization reaction on dicyclopentadiene resin with amido and maleic anhydride, wherein the dicyclopentadiene resin with amido is fo...
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| creator | LIU JIALIN HUANG WEIRU LIU YUTING LIAO DECHAO ZHANG HONGYI |
| description | The present invention provides a resin composition, which comprises a modified maleimide resin. The modified maleimide resin is formed by carrying out condensation polymerization reaction on dicyclopentadiene resin with amido and maleic anhydride, wherein the dicyclopentadiene resin with amido is formed by carrying out nitration reaction and hydrogenation reaction on dicyclopentadiene phenolic resin.
本发明提供一种树脂组合物，其包括经改质的马来酰亚胺树脂。经改质的马来酰亚胺树脂为具有胺基的二环戊二烯系树脂与马来酸酐经缩合聚合反应而成，其中前述具有胺基的二环戊二烯系树脂是由二环戊二烯酚醛树脂经硝化反应及氢化反应而形成。 |
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本发明提供一种树脂组合物，其包括经改质的马来酰亚胺树脂。经改质的马来酰亚胺树脂为具有胺基的二环戊二烯系树脂与马来酸酐经缩合聚合反应而成，其中前述具有胺基的二环戊二烯系树脂是由二环戊二烯酚醛树脂经硝化反应及氢化反应而形成。</description><language>chi ; eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; WORKING-UP</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240507&DB=EPODOC&CC=CN&NR=117986861A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240507&DB=EPODOC&CC=CN&NR=117986861A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIU JIALIN</creatorcontrib><creatorcontrib>HUANG WEIRU</creatorcontrib><creatorcontrib>LIU YUTING</creatorcontrib><creatorcontrib>LIAO DECHAO</creatorcontrib><creatorcontrib>ZHANG HONGYI</creatorcontrib><title>Resin composition and electronic component</title><description>The present invention provides a resin composition, which comprises a modified maleimide resin. The modified maleimide resin is formed by carrying out condensation polymerization reaction on dicyclopentadiene resin with amido and maleic anhydride, wherein the dicyclopentadiene resin with amido is formed by carrying out nitration reaction and hydrogenation reaction on dicyclopentadiene phenolic resin.
本发明提供一种树脂组合物，其包括经改质的马来酰亚胺树脂。经改质的马来酰亚胺树脂为具有胺基的二环戊二烯系树脂与马来酸酐经缩合聚合反应而成，其中前述具有胺基的二环戊二烯系树脂是由二环戊二烯酚醛树脂经硝化反应及氢化反应而形成。</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAKSi3OzFNIzs8tyC_OLMnMz1NIzEtRSM1JTS4pys_LTIZI5aXmlfAwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NTigsTk1LzUknhnP0NDc0sLMwszQ0djYtQAAF8qKZI</recordid><startdate>20240507</startdate><enddate>20240507</enddate><creator>LIU JIALIN</creator><creator>HUANG WEIRU</creator><creator>LIU YUTING</creator><creator>LIAO DECHAO</creator><creator>ZHANG HONGYI</creator><scope>EVB</scope></search><sort><creationdate>20240507</creationdate><title>Resin composition and electronic component</title><author>LIU JIALIN ; HUANG WEIRU ; LIU YUTING ; LIAO DECHAO ; ZHANG HONGYI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117986861A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>LIU JIALIN</creatorcontrib><creatorcontrib>HUANG WEIRU</creatorcontrib><creatorcontrib>LIU YUTING</creatorcontrib><creatorcontrib>LIAO DECHAO</creatorcontrib><creatorcontrib>ZHANG HONGYI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIU JIALIN</au><au>HUANG WEIRU</au><au>LIU YUTING</au><au>LIAO DECHAO</au><au>ZHANG HONGYI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Resin composition and electronic component</title><date>2024-05-07</date><risdate>2024</risdate><abstract>The present invention provides a resin composition, which comprises a modified maleimide resin. The modified maleimide resin is formed by carrying out condensation polymerization reaction on dicyclopentadiene resin with amido and maleic anhydride, wherein the dicyclopentadiene resin with amido is formed by carrying out nitration reaction and hydrogenation reaction on dicyclopentadiene phenolic resin.
本发明提供一种树脂组合物，其包括经改质的马来酰亚胺树脂。经改质的马来酰亚胺树脂为具有胺基的二环戊二烯系树脂与马来酸酐经缩合聚合反应而成，其中前述具有胺基的二环戊二烯系树脂是由二环戊二烯酚醛树脂经硝化反应及氢化反应而形成。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
| title | Resin composition and electronic component |
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