Laminated component laminating machine, heating plate used by laminated component laminating machine and method for balancing temperature rise rate of component
The invention aims to solve the problems that in the prior art, due to the fact that the length of a lamination cavity of a lamination assembly laminating machine is increased, the heating rate of a lamination assembly which enters the cavity first is different from that of a lamination assembly whi...
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| creator | LIU ZHENGBIN JIANG XIANGWEI WU WENBIN JIANG XIANGYUN SUN YONGJIANG ZHOU XUDONG ZHANG XUEHAI |
| description | The invention aims to solve the problems that in the prior art, due to the fact that the length of a lamination cavity of a lamination assembly laminating machine is increased, the heating rate of a lamination assembly which enters the cavity first is different from that of a lamination assembly which enters the cavity later, the lamination assembly which enters the cavity first is prone to deformation, and an adhesive film is melted before cover closing and vacuumizing; in order to overcome the defect that the prior art causes that small bubbles are generated by an adhesive film which is firstly melted in a laminated assembly and cannot be eliminated through vacuumizing, the invention provides a laminated assembly laminating machine, a heating plate used by the laminated assembly laminating machine and a method for balancing the temperature rise rate of the assembly. The laminated assembly conveying device comprises a circulating belt arranged around the heating plate, and the laminated assembly is borne by |
| format | Patent |
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The laminated assembly conveying device comprises a circulating belt arranged around the heating plate, and the laminated assembly is borne by</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING |
| title | Laminated component laminating machine, heating plate used by laminated component laminating machine and method for balancing temperature rise rate of component |
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