Seamless bonding method for multilayer substrate and test carrier plate

Seamless bonding method for multilayer substrate and test carrier plate

The invention provides a seamless joint method of a multilayer substrate and a test carrier plate, which comprises the following steps: printing solder paste on a welding surface of the test carrier plate, the solder paste having a first thickness; the multi-layer substrate and the test carrier plat...

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1. Verfasser: YI XIAOQIN
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Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description The invention provides a seamless joint method of a multilayer substrate and a test carrier plate, which comprises the following steps: printing solder paste on a welding surface of the test carrier plate, the solder paste having a first thickness; the multi-layer substrate and the test carrier plate are bonded in an opposite attaching mode through an automatic pressing device; and after the multi-layer substrate and the test carrier plate which are subjected to the butt joint are fed into a vacuum gas-phase welding furnace for tin melting, the solder paste has a third thickness. According to the seamless bonding method of the multi-layer substrate and the test support plate provided by the invention, the process flow of bonding the multi-layer substrate and the test support plate is improved, so that the flatness and the position precision of a product are ensured. 本发明提供一种多层基板与测试载板的无缝接合方法，包括：在所述测试载板的焊接面上印刷锡膏，所述锡膏具有第一厚度；使用自动压合装置将所述多层基板与所述测试载板对贴接合；将对贴接合后的多层基板与测试载板送入真空气相焊接炉进行融锡后，所述锡膏具有第三厚度。本发明提供的多层基板与测试载板的无缝接合方
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Seamless bonding method for multilayer substrate and test carrier plate
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