Liquid cooling heat dissipation system of server
The invention relates to a server liquid cooling heat dissipation system. A liquid cooling cabinet in the server liquid cooling heat dissipation system is provided with a liquid inlet manifold and a liquid outlet manifold; the first water segregator comprises a first liquid inlet pipe, a plurality o...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | YANG QI WANG XINYAN LI DIANLIN ZHANG ZIJIAN |
description | The invention relates to a server liquid cooling heat dissipation system. A liquid cooling cabinet in the server liquid cooling heat dissipation system is provided with a liquid inlet manifold and a liquid outlet manifold; the first water segregator comprises a first liquid inlet pipe, a plurality of first valve bodies and a plurality of first branch pipes, the two ends of the first liquid inlet pipe communicate with the liquid supply pipe, the first valve bodies are arranged on the first liquid inlet pipe at intervals, one end of each first branch pipe is located between every two adjacent first valve bodies and communicates with the first liquid inlet pipe, and the other end of each first branch pipe communicates with the liquid inlet manifold; the first water collector comprises a first liquid outlet pipe, a plurality of second valve bodies and a plurality of second branch pipes, the two ends of the first liquid outlet pipe are communicated with the liquid return pipe, the second valve bodies are arranged |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN117971021A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN117971021A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN117971021A3</originalsourceid><addsrcrecordid>eNrjZDDwySwszUxRSM7Pz8nMS1fISE0sUUjJLC7OLEgsyczPUyiuLC5JzVXIT1MoTi0qSy3iYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GhuaW5oYGRoaOxsSoAQB3jit-</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Liquid cooling heat dissipation system of server</title><source>esp@cenet</source><creator>YANG QI ; WANG XINYAN ; LI DIANLIN ; ZHANG ZIJIAN</creator><creatorcontrib>YANG QI ; WANG XINYAN ; LI DIANLIN ; ZHANG ZIJIAN</creatorcontrib><description>The invention relates to a server liquid cooling heat dissipation system. A liquid cooling cabinet in the server liquid cooling heat dissipation system is provided with a liquid inlet manifold and a liquid outlet manifold; the first water segregator comprises a first liquid inlet pipe, a plurality of first valve bodies and a plurality of first branch pipes, the two ends of the first liquid inlet pipe communicate with the liquid supply pipe, the first valve bodies are arranged on the first liquid inlet pipe at intervals, one end of each first branch pipe is located between every two adjacent first valve bodies and communicates with the first liquid inlet pipe, and the other end of each first branch pipe communicates with the liquid inlet manifold; the first water collector comprises a first liquid outlet pipe, a plurality of second valve bodies and a plurality of second branch pipes, the two ends of the first liquid outlet pipe are communicated with the liquid return pipe, the second valve bodies are arranged</description><language>chi ; eng</language><subject>CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; PHYSICS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240503&DB=EPODOC&CC=CN&NR=117971021A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240503&DB=EPODOC&CC=CN&NR=117971021A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YANG QI</creatorcontrib><creatorcontrib>WANG XINYAN</creatorcontrib><creatorcontrib>LI DIANLIN</creatorcontrib><creatorcontrib>ZHANG ZIJIAN</creatorcontrib><title>Liquid cooling heat dissipation system of server</title><description>The invention relates to a server liquid cooling heat dissipation system. A liquid cooling cabinet in the server liquid cooling heat dissipation system is provided with a liquid inlet manifold and a liquid outlet manifold; the first water segregator comprises a first liquid inlet pipe, a plurality of first valve bodies and a plurality of first branch pipes, the two ends of the first liquid inlet pipe communicate with the liquid supply pipe, the first valve bodies are arranged on the first liquid inlet pipe at intervals, one end of each first branch pipe is located between every two adjacent first valve bodies and communicates with the first liquid inlet pipe, and the other end of each first branch pipe communicates with the liquid inlet manifold; the first water collector comprises a first liquid outlet pipe, a plurality of second valve bodies and a plurality of second branch pipes, the two ends of the first liquid outlet pipe are communicated with the liquid return pipe, the second valve bodies are arranged</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDwySwszUxRSM7Pz8nMS1fISE0sUUjJLC7OLEgsyczPUyiuLC5JzVXIT1MoTi0qSy3iYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GhuaW5oYGRoaOxsSoAQB3jit-</recordid><startdate>20240503</startdate><enddate>20240503</enddate><creator>YANG QI</creator><creator>WANG XINYAN</creator><creator>LI DIANLIN</creator><creator>ZHANG ZIJIAN</creator><scope>EVB</scope></search><sort><creationdate>20240503</creationdate><title>Liquid cooling heat dissipation system of server</title><author>YANG QI ; WANG XINYAN ; LI DIANLIN ; ZHANG ZIJIAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117971021A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>YANG QI</creatorcontrib><creatorcontrib>WANG XINYAN</creatorcontrib><creatorcontrib>LI DIANLIN</creatorcontrib><creatorcontrib>ZHANG ZIJIAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YANG QI</au><au>WANG XINYAN</au><au>LI DIANLIN</au><au>ZHANG ZIJIAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Liquid cooling heat dissipation system of server</title><date>2024-05-03</date><risdate>2024</risdate><abstract>The invention relates to a server liquid cooling heat dissipation system. A liquid cooling cabinet in the server liquid cooling heat dissipation system is provided with a liquid inlet manifold and a liquid outlet manifold; the first water segregator comprises a first liquid inlet pipe, a plurality of first valve bodies and a plurality of first branch pipes, the two ends of the first liquid inlet pipe communicate with the liquid supply pipe, the first valve bodies are arranged on the first liquid inlet pipe at intervals, one end of each first branch pipe is located between every two adjacent first valve bodies and communicates with the first liquid inlet pipe, and the other end of each first branch pipe communicates with the liquid inlet manifold; the first water collector comprises a first liquid outlet pipe, a plurality of second valve bodies and a plurality of second branch pipes, the two ends of the first liquid outlet pipe are communicated with the liquid return pipe, the second valve bodies are arranged</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | chi ; eng |
recordid | cdi_epo_espacenet_CN117971021A |
source | esp@cenet |
subjects | CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING PHYSICS |
title | Liquid cooling heat dissipation system of server |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T18%3A24%3A27IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YANG%20QI&rft.date=2024-05-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN117971021A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |