Photomask of large-size spliced product and online measuring and positioning method

The invention provides a photomask of a large-size spliced product and an online measurement positioning method. The photomask of the large-size spliced product comprises at least two exposure unit areas with different functions and the same size, the four corners of each exposure unit area are resp...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YAN DAYONG, GAO CHANGCHENG, LIU HONGMIN
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator YAN DAYONG
GAO CHANGCHENG
LIU HONGMIN
description The invention provides a photomask of a large-size spliced product and an online measurement positioning method. The photomask of the large-size spliced product comprises at least two exposure unit areas with different functions and the same size, the four corners of each exposure unit area are respectively provided with a locking angle pattern in mirror symmetry, and the locking angle patterns are located in the chip areas of the exposure unit areas; when the photomask is adopted to carry out a splicing photoetching process on a wafer, the locking angle patterns are spliced on the wafer to form a cross mark, the cross mark divides the whole chip area of the wafer into a plurality of measuring units with the same size, and each measuring unit corresponds to one exposure unit area. According to the photomask of the large-size spliced product and the online measurement positioning method, the online measurement range can be expanded, and the process difference on the wafer level can be monitored. 本申请提供一种大尺寸拼接产品
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN117970740A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN117970740A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN117970740A3</originalsourceid><addsrcrecordid>eNqNikEKwjAQAHvxIOof1gcUWhSCRymKJxH0XpZk2waT3ZBNL75eFB_gaZhhltX9NkmRiPoEGSBgHqlW_yLQFLwlBymLm20BZAfCwTNBJNQ5ex6_MYn64oU_HqlM4tbVYsCgtPlxVW3Pp0d3qSlJT5rQElPpu2vbmoNpzL457v553n7aOM8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Photomask of large-size spliced product and online measuring and positioning method</title><source>esp@cenet</source><creator>YAN DAYONG ; GAO CHANGCHENG ; LIU HONGMIN</creator><creatorcontrib>YAN DAYONG ; GAO CHANGCHENG ; LIU HONGMIN</creatorcontrib><description>The invention provides a photomask of a large-size spliced product and an online measurement positioning method. The photomask of the large-size spliced product comprises at least two exposure unit areas with different functions and the same size, the four corners of each exposure unit area are respectively provided with a locking angle pattern in mirror symmetry, and the locking angle patterns are located in the chip areas of the exposure unit areas; when the photomask is adopted to carry out a splicing photoetching process on a wafer, the locking angle patterns are spliced on the wafer to form a cross mark, the cross mark divides the whole chip area of the wafer into a plurality of measuring units with the same size, and each measuring unit corresponds to one exposure unit area. According to the photomask of the large-size spliced product and the online measurement positioning method, the online measurement range can be expanded, and the process difference on the wafer level can be monitored. 本申请提供一种大尺寸拼接产品</description><language>chi ; eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240503&amp;DB=EPODOC&amp;CC=CN&amp;NR=117970740A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240503&amp;DB=EPODOC&amp;CC=CN&amp;NR=117970740A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAN DAYONG</creatorcontrib><creatorcontrib>GAO CHANGCHENG</creatorcontrib><creatorcontrib>LIU HONGMIN</creatorcontrib><title>Photomask of large-size spliced product and online measuring and positioning method</title><description>The invention provides a photomask of a large-size spliced product and an online measurement positioning method. The photomask of the large-size spliced product comprises at least two exposure unit areas with different functions and the same size, the four corners of each exposure unit area are respectively provided with a locking angle pattern in mirror symmetry, and the locking angle patterns are located in the chip areas of the exposure unit areas; when the photomask is adopted to carry out a splicing photoetching process on a wafer, the locking angle patterns are spliced on the wafer to form a cross mark, the cross mark divides the whole chip area of the wafer into a plurality of measuring units with the same size, and each measuring unit corresponds to one exposure unit area. According to the photomask of the large-size spliced product and the online measurement positioning method, the online measurement range can be expanded, and the process difference on the wafer level can be monitored. 本申请提供一种大尺寸拼接产品</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNikEKwjAQAHvxIOof1gcUWhSCRymKJxH0XpZk2waT3ZBNL75eFB_gaZhhltX9NkmRiPoEGSBgHqlW_yLQFLwlBymLm20BZAfCwTNBJNQ5ex6_MYn64oU_HqlM4tbVYsCgtPlxVW3Pp0d3qSlJT5rQElPpu2vbmoNpzL457v553n7aOM8</recordid><startdate>20240503</startdate><enddate>20240503</enddate><creator>YAN DAYONG</creator><creator>GAO CHANGCHENG</creator><creator>LIU HONGMIN</creator><scope>EVB</scope></search><sort><creationdate>20240503</creationdate><title>Photomask of large-size spliced product and online measuring and positioning method</title><author>YAN DAYONG ; GAO CHANGCHENG ; LIU HONGMIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117970740A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>YAN DAYONG</creatorcontrib><creatorcontrib>GAO CHANGCHENG</creatorcontrib><creatorcontrib>LIU HONGMIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAN DAYONG</au><au>GAO CHANGCHENG</au><au>LIU HONGMIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Photomask of large-size spliced product and online measuring and positioning method</title><date>2024-05-03</date><risdate>2024</risdate><abstract>The invention provides a photomask of a large-size spliced product and an online measurement positioning method. The photomask of the large-size spliced product comprises at least two exposure unit areas with different functions and the same size, the four corners of each exposure unit area are respectively provided with a locking angle pattern in mirror symmetry, and the locking angle patterns are located in the chip areas of the exposure unit areas; when the photomask is adopted to carry out a splicing photoetching process on a wafer, the locking angle patterns are spliced on the wafer to form a cross mark, the cross mark divides the whole chip area of the wafer into a plurality of measuring units with the same size, and each measuring unit corresponds to one exposure unit area. According to the photomask of the large-size spliced product and the online measurement positioning method, the online measurement range can be expanded, and the process difference on the wafer level can be monitored. 本申请提供一种大尺寸拼接产品</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN117970740A
source esp@cenet
subjects APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
title Photomask of large-size spliced product and online measuring and positioning method
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-06T21%3A20%3A29IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YAN%20DAYONG&rft.date=2024-05-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN117970740A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true