Electronic device and method of manufacturing same
An electronic device and a method of manufacturing the electronic device. In one example, an electronic device includes a substrate including a conductive structure and a dielectric structure including an upper dielectric layer, an electronic component over a top side of the substrate and coupled to...
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| creator | JIN SHUYONG KI WON MUN HWANG TAE-YOUNG HAN DONG-HWA |
| description | An electronic device and a method of manufacturing the electronic device. In one example, an electronic device includes a substrate including a conductive structure and a dielectric structure including an upper dielectric layer, an electronic component over a top side of the substrate and coupled to the conductive structure, an encapsulant over the top side of the substrate and adjacent to a lateral side of the electronic component, and a dielectric layer over the top side of the substrate and coupled to the conductive structure. And a shield over the top side of the electronic component and contacting a lateral side of the encapsulant and a first lateral side of the substrate. The conductive structure includes a first tab structure at the first lateral side of the substrate, and wherein the first tab structure contacts the shield and extends over the upper dielectric layer. Other examples and related methods are also disclosed herein.
电子装置及制造电子装置的方法。在一个实例中，一种电子装置包括：衬底，其包括导电结构和电介质结构，所述电介质结构包括上部电介质层，电子组件，其在所述衬 |
| format | Patent |
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电子装置及制造电子装置的方法。在一个实例中，一种电子装置包括：衬底，其包括导电结构和电介质结构，所述电介质结构包括上部电介质层，电子组件，其在所述衬</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240430&DB=EPODOC&CC=CN&NR=117954404A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240430&DB=EPODOC&CC=CN&NR=117954404A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JIN SHUYONG</creatorcontrib><creatorcontrib>KI WON MUN</creatorcontrib><creatorcontrib>HWANG TAE-YOUNG</creatorcontrib><creatorcontrib>HAN DONG-HWA</creatorcontrib><title>Electronic device and method of manufacturing same</title><description>An electronic device and a method of manufacturing the electronic device. In one example, an electronic device includes a substrate including a conductive structure and a dielectric structure including an upper dielectric layer, an electronic component over a top side of the substrate and coupled to the conductive structure, an encapsulant over the top side of the substrate and adjacent to a lateral side of the electronic component, and a dielectric layer over the top side of the substrate and coupled to the conductive structure. And a shield over the top side of the electronic component and contacting a lateral side of the encapsulant and a first lateral side of the substrate. The conductive structure includes a first tab structure at the first lateral side of the substrate, and wherein the first tab structure contacts the shield and extends over the upper dielectric layer. Other examples and related methods are also disclosed herein.
电子装置及制造电子装置的方法。在一个实例中，一种电子装置包括：衬底，其包括导电结构和电介质结构，所述电介质结构包括上部电介质层，电子组件，其在所述衬</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDByzUlNLinKz8tMVkhJLctMTlVIzEtRyE0tychPUchPU8hNzCtNS0wuKS3KzEtXKE7MTeVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaG5pamJiYGJo7GxKgBAL4MK_o</recordid><startdate>20240430</startdate><enddate>20240430</enddate><creator>JIN SHUYONG</creator><creator>KI WON MUN</creator><creator>HWANG TAE-YOUNG</creator><creator>HAN DONG-HWA</creator><scope>EVB</scope></search><sort><creationdate>20240430</creationdate><title>Electronic device and method of manufacturing same</title><author>JIN SHUYONG ; KI WON MUN ; HWANG TAE-YOUNG ; HAN DONG-HWA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117954404A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>JIN SHUYONG</creatorcontrib><creatorcontrib>KI WON MUN</creatorcontrib><creatorcontrib>HWANG TAE-YOUNG</creatorcontrib><creatorcontrib>HAN DONG-HWA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JIN SHUYONG</au><au>KI WON MUN</au><au>HWANG TAE-YOUNG</au><au>HAN DONG-HWA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electronic device and method of manufacturing same</title><date>2024-04-30</date><risdate>2024</risdate><abstract>An electronic device and a method of manufacturing the electronic device. In one example, an electronic device includes a substrate including a conductive structure and a dielectric structure including an upper dielectric layer, an electronic component over a top side of the substrate and coupled to the conductive structure, an encapsulant over the top side of the substrate and adjacent to a lateral side of the electronic component, and a dielectric layer over the top side of the substrate and coupled to the conductive structure. And a shield over the top side of the electronic component and contacting a lateral side of the encapsulant and a first lateral side of the substrate. The conductive structure includes a first tab structure at the first lateral side of the substrate, and wherein the first tab structure contacts the shield and extends over the upper dielectric layer. Other examples and related methods are also disclosed herein.
电子装置及制造电子装置的方法。在一个实例中，一种电子装置包括：衬底，其包括导电结构和电介质结构，所述电介质结构包括上部电介质层，电子组件，其在所述衬</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Electronic device and method of manufacturing same |
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