Preparation method of low-profile high-tensile-strength super-thick electrolytic copper foil

The invention discloses a preparation method of a low-profile high-tensile-strength super-thick electrolytic copper foil. The preparation method specifically comprises the following steps: S1, dissolving a metal copper simple substance into a copper sulfate electrolyte; s2, adding a certain concentration of intercellular diazobenzene and polyethylene glycol mixed additive into the electrolyte; and S3, under a certain current density, copper is continuously deposited on the cathode titanium roller for electrolysis to prepare the copper foil. The thickness specification of the prepared ultra-thick electrolytic copper foil is 210 microns, the rough surface roughness of the electrolytic copper foil can be regulated and controlled, Rz is 3.0-5.5 microns, the signal transmission loss is low, and the ultra-thick electrolytic copper foil is suitable for high-frequency and high-speed plates; the tensile strength of the copper foil at normal temperature can reach more than 500MPa, the tensile strength at high temperatu