Method for manufacturing circuit board
A manufacturing method of a circuit board includes the following steps. A substrate is provided. A printing process is performed to form a conductive pattern on the upper surface of the substrate, the conductive pattern extending on the upper surface of the substrate. And performing a thermoplastic...
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| creator | CHEN HANQIANG ZHOU SHANGZHI HUANG HOUSHENG |
| description | A manufacturing method of a circuit board includes the following steps. A substrate is provided. A printing process is performed to form a conductive pattern on the upper surface of the substrate, the conductive pattern extending on the upper surface of the substrate. And performing a thermoplastic process, so that at least one part of the base material is deformed in any direction which is not parallel to the upper surface, the base material is molded into a molded base material, and at least one part of the conductive pattern is deformed in any direction which is not parallel to the upper surface, and the conductive pattern is molded into a circuit pattern. According to the manufacturing method of the circuit board, the circuit and the base material can be simply and quickly integrated, so that the flexible circuit board with a three-dimensional structure can be prepared.
一种电路板的制造方法包括以下步骤。提供基材。进行印刷工艺，以于基材的上表面形成导电图案，其中导电图案在基材的上表面上延伸。进行热塑工艺，使基材的至少一部分在非平行于上表面的任一方向上产生形变，使基材成型为塑形基材，并使导电图案的至少一部分在非平行于上表面的任一方向上产生形变 |
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一种电路板的制造方法包括以下步骤。提供基材。进行印刷工艺，以于基材的上表面形成导电图案，其中导电图案在基材的上表面上延伸。进行热塑工艺，使基材的至少一部分在非平行于上表面的任一方向上产生形变，使基材成型为塑形基材，并使导电图案的至少一部分在非平行于上表面的任一方向上产生形变</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240423&DB=EPODOC&CC=CN&NR=117917922A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240423&DB=EPODOC&CC=CN&NR=117917922A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN HANQIANG</creatorcontrib><creatorcontrib>ZHOU SHANGZHI</creatorcontrib><creatorcontrib>HUANG HOUSHENG</creatorcontrib><title>Method for manufacturing circuit board</title><description>A manufacturing method of a circuit board includes the following steps. A substrate is provided. A printing process is performed to form a conductive pattern on the upper surface of the substrate, the conductive pattern extending on the upper surface of the substrate. And performing a thermoplastic process, so that at least one part of the base material is deformed in any direction which is not parallel to the upper surface, the base material is molded into a molded base material, and at least one part of the conductive pattern is deformed in any direction which is not parallel to the upper surface, and the conductive pattern is molded into a circuit pattern. According to the manufacturing method of the circuit board, the circuit and the base material can be simply and quickly integrated, so that the flexible circuit board with a three-dimensional structure can be prepared.
一种电路板的制造方法包括以下步骤。提供基材。进行印刷工艺，以于基材的上表面形成导电图案，其中导电图案在基材的上表面上延伸。进行热塑工艺，使基材的至少一部分在非平行于上表面的任一方向上产生形变，使基材成型为塑形基材，并使导电图案的至少一部分在非平行于上表面的任一方向上产生形变</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDzTS3JyE9RSMsvUshNzCtNS0wuKS3KzEtXSM4sSi7NLFFIyk8sSuFhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaG5pZAZGTkaEyMGgB6xyey</recordid><startdate>20240423</startdate><enddate>20240423</enddate><creator>CHEN HANQIANG</creator><creator>ZHOU SHANGZHI</creator><creator>HUANG HOUSHENG</creator><scope>EVB</scope></search><sort><creationdate>20240423</creationdate><title>Method for manufacturing circuit board</title><author>CHEN HANQIANG ; ZHOU SHANGZHI ; HUANG HOUSHENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117917922A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>CHEN HANQIANG</creatorcontrib><creatorcontrib>ZHOU SHANGZHI</creatorcontrib><creatorcontrib>HUANG HOUSHENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHEN HANQIANG</au><au>ZHOU SHANGZHI</au><au>HUANG HOUSHENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for manufacturing circuit board</title><date>2024-04-23</date><risdate>2024</risdate><abstract>A manufacturing method of a circuit board includes the following steps. A substrate is provided. A printing process is performed to form a conductive pattern on the upper surface of the substrate, the conductive pattern extending on the upper surface of the substrate. And performing a thermoplastic process, so that at least one part of the base material is deformed in any direction which is not parallel to the upper surface, the base material is molded into a molded base material, and at least one part of the conductive pattern is deformed in any direction which is not parallel to the upper surface, and the conductive pattern is molded into a circuit pattern. According to the manufacturing method of the circuit board, the circuit and the base material can be simply and quickly integrated, so that the flexible circuit board with a three-dimensional structure can be prepared.
一种电路板的制造方法包括以下步骤。提供基材。进行印刷工艺，以于基材的上表面形成导电图案，其中导电图案在基材的上表面上延伸。进行热塑工艺，使基材的至少一部分在非平行于上表面的任一方向上产生形变，使基材成型为塑形基材，并使导电图案的至少一部分在非平行于上表面的任一方向上产生形变</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Method for manufacturing circuit board |
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