Photoelectric co-packaging module based on advanced packaging and preparation method thereof

The invention discloses a photoelectric co-packaging module based on advanced packaging and a preparation method of the photoelectric co-packaging module. The photoelectric co-packaging module comprises a photoelectric intermediary substrate; the optical chip and the electric chip are located on the first surface of the photoelectric intermediary substrate and are electrically connected through the photoelectric intermediary substrate; the circuit board is located on the second surface of the photoelectric intermediary substrate and is electrically connected with the optical chip and the electric chip through the photoelectric intermediary substrate; the optical fiber array component is positioned on the first surface of the photoelectric intermediary substrate and is coupled with the photoelectric intermediary substrate; a grating coupler and a first optical waveguide are arranged in the photoelectric intermediary substrate and are used for transmitting optical signals between the optical fiber array compone