Reaction chamber assembly for plasma processing device and preparation method of reaction chamber assembly
The invention discloses a reaction chamber assembly for a plasma processing device and a preparation method of the reaction chamber assembly. The reaction chamber assembly comprises: a reaction chamber assembly body; the plasma corrosion resistant coating is formed on the surface of the reaction cha...
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| creator | SUN XIANG AVOYAN, ARMEN YIN ZHIYAO |
| description | The invention discloses a reaction chamber assembly for a plasma processing device and a preparation method of the reaction chamber assembly. The reaction chamber assembly comprises: a reaction chamber assembly body; the plasma corrosion resistant coating is formed on the surface of the reaction chamber assembly body, and the plasma corrosion resistant coating comprises any one or a combination of any two or more of a yttrium nitride coating, a yttrium carbide coating and a yttrium boride coating. According to the invention, any plasma corrosion resistant coating of yttrium nitride, yttrium carbide and yttrium boride is formed on the reaction chamber assembly body through methods such as 3D printing, and the structures of yttrium nitride, yttrium carbide and yttrium boride are more stable than those of traditional yttrium-containing coatings such as Y2O3 and the like; and the process requirements of long-term chemical, plasma or thermal corrosion and/or high-power physical bombardment are met.
本发明公开了一种用于等离子处理 |
| format | Patent |
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本发明公开了一种用于等离子处理</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjLsKwkAQRbexEPUfxg8QDBokpQTFykLsw2T3xqzsi51F8O8VsRWsLhzOuVN1v4B1sTGQHtn3yMQi8L170hAzJcfimVKOGiI23MjgYTWIg3lTJM78qT3KGA3FgfKvw7maDOwEi-_O1PJ4uLanFVLsIIk1AkrXnqtq16y3dVPvN_84L82dQZE</recordid><startdate>20240419</startdate><enddate>20240419</enddate><creator>SUN XIANG</creator><creator>AVOYAN, ARMEN</creator><creator>YIN ZHIYAO</creator><scope>EVB</scope></search><sort><creationdate>20240419</creationdate><title>Reaction chamber assembly for plasma processing device and preparation method of reaction chamber assembly</title><author>SUN XIANG ; AVOYAN, ARMEN ; YIN ZHIYAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117904595A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>SUN XIANG</creatorcontrib><creatorcontrib>AVOYAN, ARMEN</creatorcontrib><creatorcontrib>YIN ZHIYAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUN XIANG</au><au>AVOYAN, ARMEN</au><au>YIN ZHIYAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Reaction chamber assembly for plasma processing device and preparation method of reaction chamber assembly</title><date>2024-04-19</date><risdate>2024</risdate><abstract>The invention discloses a reaction chamber assembly for a plasma processing device and a preparation method of the reaction chamber assembly. The reaction chamber assembly comprises: a reaction chamber assembly body; the plasma corrosion resistant coating is formed on the surface of the reaction chamber assembly body, and the plasma corrosion resistant coating comprises any one or a combination of any two or more of a yttrium nitride coating, a yttrium carbide coating and a yttrium boride coating. According to the invention, any plasma corrosion resistant coating of yttrium nitride, yttrium carbide and yttrium boride is formed on the reaction chamber assembly body through methods such as 3D printing, and the structures of yttrium nitride, yttrium carbide and yttrium boride are more stable than those of traditional yttrium-containing coatings such as Y2O3 and the like; and the process requirements of long-term chemical, plasma or thermal corrosion and/or high-power physical bombardment are met.
本发明公开了一种用于等离子处理</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Reaction chamber assembly for plasma processing device and preparation method of reaction chamber assembly |
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