Semiconductor product packaging structure and method

The invention discloses a semiconductor product packaging structure which comprises a lead frame which comprises a plurality of chip mounting units, and each chip mounting unit comprises a chip carrying island which is used for carrying a semiconductor product chip. The slide island has a structure...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	TIAN MAOKANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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