Semiconductor product packaging structure and method

Semiconductor product packaging structure and method

The invention discloses a semiconductor product packaging structure which comprises a lead frame which comprises a plurality of chip mounting units, and each chip mounting unit comprises a chip carrying island which is used for carrying a semiconductor product chip. The slide island has a structure...

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1. Verfasser: TIAN MAOKANG
Format: Patent
Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description The invention discloses a semiconductor product packaging structure which comprises a lead frame which comprises a plurality of chip mounting units, and each chip mounting unit comprises a chip carrying island which is used for carrying a semiconductor product chip. The slide island has a structure with the largest area, and a circle of waterproof structure composed of grooves is arranged on the peripheral edge of the slide island. The area of the slide island is the maximum area obtained by the slide island obtained by calculation and simulation on the basis of the effective size of a plastic package body formed by the lead frame, and the area of a semiconductor product chip capable of being packaged by the slide island is increased by adopting the maximum area structure. The invention further discloses a semiconductor product packaging method. According to the invention, the capability of packaging a large-size semiconductor chip product can be improved, the product quality can be ensured, the product stres
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Semiconductor product packaging structure and method
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