SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
The invention discloses a substrate processing apparatus and a substrate processing method, which can improve the cleanliness of a processing liquid supply system. The substrate processing apparatus includes: a storage unit configured to temporarily store a processing liquid for processing a substra...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | UMENO SHINICHI ANAMOTO ATSUSHI |
| description | The invention discloses a substrate processing apparatus and a substrate processing method, which can improve the cleanliness of a processing liquid supply system. The substrate processing apparatus includes: a storage unit configured to temporarily store a processing liquid for processing a substrate; a replenishment unit configured to replenish the processing liquid to the storage unit; a flow rate measurement unit configured to measure a flow rate of the processing liquid replenished to the reservoir; a gas supply unit configured so as to supply gas to the storage unit and pressurize the inside of the storage unit; and a control unit. The control unit is configured to execute a process of replenishing the processing liquid from the replenishing unit to the storage unit while controlling the gas supply unit on the basis of the value measured by the flow rate measurement unit to adjust the magnitude of the pressure applied to the inside of the storage unit.
本公开说明基板处理装置和基板处理方法，能够提高处理液的供给系统的清洁度。基板处理装置具备：贮存部，其构 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN117894710A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN117894710A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN117894710A3</originalsourceid><addsrcrecordid>eNrjZLALDnUKDglyDHFVCAjyd3YNDvb0c1dwDAhwBIqFBis4-rkoYFXi6xri4e_Cw8CalphTnMoLpbkZFN1cQ5w9dFML8uNTiwsSk1PzUkvinf0MDc0tLE3MDQ0cjYlRAwCbiiqq</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</title><source>esp@cenet</source><creator>UMENO SHINICHI ; ANAMOTO ATSUSHI</creator><creatorcontrib>UMENO SHINICHI ; ANAMOTO ATSUSHI</creatorcontrib><description>The invention discloses a substrate processing apparatus and a substrate processing method, which can improve the cleanliness of a processing liquid supply system. The substrate processing apparatus includes: a storage unit configured to temporarily store a processing liquid for processing a substrate; a replenishment unit configured to replenish the processing liquid to the storage unit; a flow rate measurement unit configured to measure a flow rate of the processing liquid replenished to the reservoir; a gas supply unit configured so as to supply gas to the storage unit and pressurize the inside of the storage unit; and a control unit. The control unit is configured to execute a process of replenishing the processing liquid from the replenishing unit to the storage unit while controlling the gas supply unit on the basis of the value measured by the flow rate measurement unit to adjust the magnitude of the pressure applied to the inside of the storage unit.
本公开说明基板处理装置和基板处理方法，能够提高处理液的供给系统的清洁度。基板处理装置具备：贮存部，其构</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240416&DB=EPODOC&CC=CN&NR=117894710A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240416&DB=EPODOC&CC=CN&NR=117894710A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>UMENO SHINICHI</creatorcontrib><creatorcontrib>ANAMOTO ATSUSHI</creatorcontrib><title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</title><description>The invention discloses a substrate processing apparatus and a substrate processing method, which can improve the cleanliness of a processing liquid supply system. The substrate processing apparatus includes: a storage unit configured to temporarily store a processing liquid for processing a substrate; a replenishment unit configured to replenish the processing liquid to the storage unit; a flow rate measurement unit configured to measure a flow rate of the processing liquid replenished to the reservoir; a gas supply unit configured so as to supply gas to the storage unit and pressurize the inside of the storage unit; and a control unit. The control unit is configured to execute a process of replenishing the processing liquid from the replenishing unit to the storage unit while controlling the gas supply unit on the basis of the value measured by the flow rate measurement unit to adjust the magnitude of the pressure applied to the inside of the storage unit.
本公开说明基板处理装置和基板处理方法，能够提高处理液的供给系统的清洁度。基板处理装置具备：贮存部，其构</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLALDnUKDglyDHFVCAjyd3YNDvb0c1dwDAhwBIqFBis4-rkoYFXi6xri4e_Cw8CalphTnMoLpbkZFN1cQ5w9dFML8uNTiwsSk1PzUkvinf0MDc0tLE3MDQ0cjYlRAwCbiiqq</recordid><startdate>20240416</startdate><enddate>20240416</enddate><creator>UMENO SHINICHI</creator><creator>ANAMOTO ATSUSHI</creator><scope>EVB</scope></search><sort><creationdate>20240416</creationdate><title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</title><author>UMENO SHINICHI ; ANAMOTO ATSUSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117894710A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>UMENO SHINICHI</creatorcontrib><creatorcontrib>ANAMOTO ATSUSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>UMENO SHINICHI</au><au>ANAMOTO ATSUSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</title><date>2024-04-16</date><risdate>2024</risdate><abstract>The invention discloses a substrate processing apparatus and a substrate processing method, which can improve the cleanliness of a processing liquid supply system. The substrate processing apparatus includes: a storage unit configured to temporarily store a processing liquid for processing a substrate; a replenishment unit configured to replenish the processing liquid to the storage unit; a flow rate measurement unit configured to measure a flow rate of the processing liquid replenished to the reservoir; a gas supply unit configured so as to supply gas to the storage unit and pressurize the inside of the storage unit; and a control unit. The control unit is configured to execute a process of replenishing the processing liquid from the replenishing unit to the storage unit while controlling the gas supply unit on the basis of the value measured by the flow rate measurement unit to adjust the magnitude of the pressure applied to the inside of the storage unit.
本公开说明基板处理装置和基板处理方法，能够提高处理液的供给系统的清洁度。基板处理装置具备：贮存部，其构</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN117894710A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-20T12%3A54%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=UMENO%20SHINICHI&rft.date=2024-04-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN117894710A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |