Packaging process for light-emitting device of indicating device and light-emitting device

Packaging process for light-emitting device of indicating device and light-emitting device

The invention relates to the technical field of light-emitting device packaging, and provides a packaging process for a light-emitting device of an indicating device and the light-emitting device, and the packaging process comprises the steps: obtaining the side length size a of a light-transmitting...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LONG CHENGHAI, LI WEI'EN, HUANG JIANZHONG, LI QINGLIANG, GAO ZHIQIANG
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator LONG CHENGHAI
LI WEI'EN
HUANG JIANZHONG
LI QINGLIANG
GAO ZHIQIANG
description The invention relates to the technical field of light-emitting device packaging, and provides a packaging process for a light-emitting device of an indicating device and the light-emitting device, and the packaging process comprises the steps: obtaining the side length size a of a light-transmitting surface which is rectangular; obtaining the diameter dimension d of a light-emitting surface, wherein the light-emitting surface is circular; obtaining a distance size b from the light-transmitting surface to the perforated surface; the hole depth size c from the hole opening surface to the light emitting surface is obtained; the target side length dimension e of the perforated surface is obtained, and the difference value of the target side length dimension e of the perforated surface and the diameter dimension d, the hole depth dimension c, the difference value of the side length dimension a and the diameter dimension d of the light-transmitting surface and the sum value of the distance dimension b and the hole
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN117878197A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN117878197A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN117878197A3</originalsourceid><addsrcrecordid>eNrjZIgKSEzOTkzPzEtXKCjKT04tLlZIyy9SyMlMzyjRTc3NLCkBSaWklmUmpyrkpylk5qVkJiciCybmpWBXzsPAmpaYU5zKC6W5GRTdXEOcPXRTC_LjU4sLEpNT81JL4p39DA3NLcwtDC3NHY2JUQMAKyQ7LA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Packaging process for light-emitting device of indicating device and light-emitting device</title><source>esp@cenet</source><creator>LONG CHENGHAI ; LI WEI'EN ; HUANG JIANZHONG ; LI QINGLIANG ; GAO ZHIQIANG</creator><creatorcontrib>LONG CHENGHAI ; LI WEI'EN ; HUANG JIANZHONG ; LI QINGLIANG ; GAO ZHIQIANG</creatorcontrib><description>The invention relates to the technical field of light-emitting device packaging, and provides a packaging process for a light-emitting device of an indicating device and the light-emitting device, and the packaging process comprises the steps: obtaining the side length size a of a light-transmitting surface which is rectangular; obtaining the diameter dimension d of a light-emitting surface, wherein the light-emitting surface is circular; obtaining a distance size b from the light-transmitting surface to the perforated surface; the hole depth size c from the hole opening surface to the light emitting surface is obtained; the target side length dimension e of the perforated surface is obtained, and the difference value of the target side length dimension e of the perforated surface and the diameter dimension d, the hole depth dimension c, the difference value of the side length dimension a and the diameter dimension d of the light-transmitting surface and the sum value of the distance dimension b and the hole</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240412&amp;DB=EPODOC&amp;CC=CN&amp;NR=117878197A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240412&amp;DB=EPODOC&amp;CC=CN&amp;NR=117878197A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LONG CHENGHAI</creatorcontrib><creatorcontrib>LI WEI'EN</creatorcontrib><creatorcontrib>HUANG JIANZHONG</creatorcontrib><creatorcontrib>LI QINGLIANG</creatorcontrib><creatorcontrib>GAO ZHIQIANG</creatorcontrib><title>Packaging process for light-emitting device of indicating device and light-emitting device</title><description>The invention relates to the technical field of light-emitting device packaging, and provides a packaging process for a light-emitting device of an indicating device and the light-emitting device, and the packaging process comprises the steps: obtaining the side length size a of a light-transmitting surface which is rectangular; obtaining the diameter dimension d of a light-emitting surface, wherein the light-emitting surface is circular; obtaining a distance size b from the light-transmitting surface to the perforated surface; the hole depth size c from the hole opening surface to the light emitting surface is obtained; the target side length dimension e of the perforated surface is obtained, and the difference value of the target side length dimension e of the perforated surface and the diameter dimension d, the hole depth dimension c, the difference value of the side length dimension a and the diameter dimension d of the light-transmitting surface and the sum value of the distance dimension b and the hole</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIgKSEzOTkzPzEtXKCjKT04tLlZIyy9SyMlMzyjRTc3NLCkBSaWklmUmpyrkpylk5qVkJiciCybmpWBXzsPAmpaYU5zKC6W5GRTdXEOcPXRTC_LjU4sLEpNT81JL4p39DA3NLcwtDC3NHY2JUQMAKyQ7LA</recordid><startdate>20240412</startdate><enddate>20240412</enddate><creator>LONG CHENGHAI</creator><creator>LI WEI'EN</creator><creator>HUANG JIANZHONG</creator><creator>LI QINGLIANG</creator><creator>GAO ZHIQIANG</creator><scope>EVB</scope></search><sort><creationdate>20240412</creationdate><title>Packaging process for light-emitting device of indicating device and light-emitting device</title><author>LONG CHENGHAI ; LI WEI'EN ; HUANG JIANZHONG ; LI QINGLIANG ; GAO ZHIQIANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117878197A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LONG CHENGHAI</creatorcontrib><creatorcontrib>LI WEI'EN</creatorcontrib><creatorcontrib>HUANG JIANZHONG</creatorcontrib><creatorcontrib>LI QINGLIANG</creatorcontrib><creatorcontrib>GAO ZHIQIANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LONG CHENGHAI</au><au>LI WEI'EN</au><au>HUANG JIANZHONG</au><au>LI QINGLIANG</au><au>GAO ZHIQIANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Packaging process for light-emitting device of indicating device and light-emitting device</title><date>2024-04-12</date><risdate>2024</risdate><abstract>The invention relates to the technical field of light-emitting device packaging, and provides a packaging process for a light-emitting device of an indicating device and the light-emitting device, and the packaging process comprises the steps: obtaining the side length size a of a light-transmitting surface which is rectangular; obtaining the diameter dimension d of a light-emitting surface, wherein the light-emitting surface is circular; obtaining a distance size b from the light-transmitting surface to the perforated surface; the hole depth size c from the hole opening surface to the light emitting surface is obtained; the target side length dimension e of the perforated surface is obtained, and the difference value of the target side length dimension e of the perforated surface and the diameter dimension d, the hole depth dimension c, the difference value of the side length dimension a and the diameter dimension d of the light-transmitting surface and the sum value of the distance dimension b and the hole</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN117878197A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Packaging process for light-emitting device of indicating device and light-emitting device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-24T15%3A54%3A05IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LONG%20CHENGHAI&rft.date=2024-04-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN117878197A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true