Curable resin composition and electronic component device

A curable resin composition in which (1) the maximum temperature of tan [delta] is less than 120 DEG C, (2) the maximum value of tan [delta] exceeds 0.400, and (3) the maximum value of tan [delta] is more than 0.400, in a chart obtained by performing dynamic viscoelasticity measurement on a cured re...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HATAKEYAMA KEIICHI, YAMAMOTO TAKAYA, YOKOKURA AI, NISHIYAMA TOMOO, KANG DONGCHUL, KIM KWI-HWA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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