Curable resin composition and electronic component device
A curable resin composition in which (1) the maximum temperature of tan [delta] is less than 120 DEG C, (2) the maximum value of tan [delta] exceeds 0.400, and (3) the maximum value of tan [delta] is more than 0.400, in a chart obtained by performing dynamic viscoelasticity measurement on a cured re...
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| creator | HATAKEYAMA KEIICHI YAMAMOTO TAKAYA YOKOKURA AI NISHIYAMA TOMOO KANG DONGCHUL KIM KWI-HWA |
| description | A curable resin composition in which (1) the maximum temperature of tan [delta] is less than 120 DEG C, (2) the maximum value of tan [delta] exceeds 0.400, and (3) the maximum value of tan [delta] is more than 0.400, in a chart obtained by performing dynamic viscoelasticity measurement on a cured resin product of the curable resin composition, where tan [delta] is the longitudinal axis and the horizontal axis is 30-260 DEG C, and (4) the temperature at which tan [delta] is the maximum is less than 120 DEG C, and (5) the temperature at which tan [delta] is the maximum is less than 120 DEG C. And (3) the total of the tan [delta] values at 220 DEG C, 230 DEG C, 240 DEG C and 250 DEG C exceeds 0.400, or the total of the tan [delta] values at 70 DEG C, 80 DEG C and 90 DEG C exceeds 0.600.
一种硬化性树脂组合物，在通过对硬化性树脂组合物的树脂硬化物进行动态粘弹性测定而获得的将纵轴设为tanδ且将横轴设为30℃～260℃的温度的图表中，(1)tanδ成为最大的温度未满120℃，(2)tanδ的最大值超过0.400，且(3)220℃、230℃、240℃及250℃各温度下的tanδ值的合计超过0.400或者70℃、80℃及90℃各温度下的tanδ值的合计超过0.600。 |
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一种硬化性树脂组合物，在通过对硬化性树脂组合物的树脂硬化物进行动态粘弹性测定而获得的将纵轴设为tanδ且将横轴设为30℃～260℃的温度的图表中，(1)tanδ成为最大的温度未满120℃，(2)tanδ的最大值超过0.400，且(3)220℃、230℃、240℃及250℃各温度下的tanδ值的合计超过0.400或者70℃、80℃及90℃各温度下的tanδ值的合计超过0.600。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB0Li1KTMpJVShKLc7MU0jOzy3IL84syczPU0jMS1FIzUlNLinKz8tMhkjlpeaVKKSklmUmp_IwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NTigsTk1LzUknhnP0NDcwtTC0sjE0djYtQAAG-nLys</recordid><startdate>20240409</startdate><enddate>20240409</enddate><creator>HATAKEYAMA KEIICHI</creator><creator>YAMAMOTO TAKAYA</creator><creator>YOKOKURA AI</creator><creator>NISHIYAMA TOMOO</creator><creator>KANG DONGCHUL</creator><creator>KIM KWI-HWA</creator><scope>EVB</scope></search><sort><creationdate>20240409</creationdate><title>Curable resin composition and electronic component device</title><author>HATAKEYAMA KEIICHI ; YAMAMOTO TAKAYA ; YOKOKURA AI ; NISHIYAMA TOMOO ; KANG DONGCHUL ; KIM KWI-HWA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117858924A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>HATAKEYAMA KEIICHI</creatorcontrib><creatorcontrib>YAMAMOTO TAKAYA</creatorcontrib><creatorcontrib>YOKOKURA AI</creatorcontrib><creatorcontrib>NISHIYAMA TOMOO</creatorcontrib><creatorcontrib>KANG DONGCHUL</creatorcontrib><creatorcontrib>KIM KWI-HWA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HATAKEYAMA KEIICHI</au><au>YAMAMOTO TAKAYA</au><au>YOKOKURA AI</au><au>NISHIYAMA TOMOO</au><au>KANG DONGCHUL</au><au>KIM KWI-HWA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Curable resin composition and electronic component device</title><date>2024-04-09</date><risdate>2024</risdate><abstract>A curable resin composition in which (1) the maximum temperature of tan [delta] is less than 120 DEG C, (2) the maximum value of tan [delta] exceeds 0.400, and (3) the maximum value of tan [delta] is more than 0.400, in a chart obtained by performing dynamic viscoelasticity measurement on a cured resin product of the curable resin composition, where tan [delta] is the longitudinal axis and the horizontal axis is 30-260 DEG C, and (4) the temperature at which tan [delta] is the maximum is less than 120 DEG C, and (5) the temperature at which tan [delta] is the maximum is less than 120 DEG C. And (3) the total of the tan [delta] values at 220 DEG C, 230 DEG C, 240 DEG C and 250 DEG C exceeds 0.400, or the total of the tan [delta] values at 70 DEG C, 80 DEG C and 90 DEG C exceeds 0.600.
一种硬化性树脂组合物，在通过对硬化性树脂组合物的树脂硬化物进行动态粘弹性测定而获得的将纵轴设为tanδ且将横轴设为30℃～260℃的温度的图表中，(1)tanδ成为最大的温度未满120℃，(2)tanδ的最大值超过0.400，且(3)220℃、230℃、240℃及250℃各温度下的tanδ值的合计超过0.400或者70℃、80℃及90℃各温度下的tanδ值的合计超过0.600。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | Curable resin composition and electronic component device |
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