Temperature difference energy taking cooling device
The invention discloses a temperature difference energy-taking cooling device, and belongs to the field of embedded power equipment.The temperature difference energy-taking cooling device firstly obtains heat energy of a chip to be cooled through a temperature difference energy-taking module to supp...
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| creator | LIU QING HE LIN FAN MEIQI LIN XIN BI YINGHUA GUAN XIN XU JIYUAN LI YILIN MA CHAOYANG LIU XINYU LI XIAO SUN GUANGLEI LIU TONG JIANG XIAOXU LI XUXU PANG SUMIN TAN CHUANLIANG LI ZHIHE HU JINXI YANG FAN WU TIANYI LI YONGLIN ZHAO XIAOMIN WANG QILONG ZHANG HANG GAO FANG LIU WENKUI |
| description | The invention discloses a temperature difference energy-taking cooling device, and belongs to the field of embedded power equipment.The temperature difference energy-taking cooling device firstly obtains heat energy of a chip to be cooled through a temperature difference energy-taking module to supply power to a sensing module and a temperature regulation and control module; and secondly, the temperature regulation and control module regulates and controls the temperature of the chip to be cooled according to the data collected by the sensing module so as to realize regulation and control of the chip to be cooled. Wherein the temperature difference energy taking module directly faces the upper portion of the chip and can take energy to the maximum extent, and the temperature difference energy taking module can switch the position at any time by arranging the supporting frame so as to obtain heat energy of different chips. Temperature difference energy taking can be flexibly switched through the supporting fra |
| format | Patent |
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Wherein the temperature difference energy taking module directly faces the upper portion of the chip and can take energy to the maximum extent, and the temperature difference energy taking module can switch the position at any time by arranging the supporting frame so as to obtain heat energy of different chips. Temperature difference energy taking can be flexibly switched through the supporting fra</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERATION ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240402&DB=EPODOC&CC=CN&NR=117810178A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240402&DB=EPODOC&CC=CN&NR=117810178A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIU QING</creatorcontrib><creatorcontrib>HE LIN</creatorcontrib><creatorcontrib>FAN MEIQI</creatorcontrib><creatorcontrib>LIN XIN</creatorcontrib><creatorcontrib>BI YINGHUA</creatorcontrib><creatorcontrib>GUAN XIN</creatorcontrib><creatorcontrib>XU JIYUAN</creatorcontrib><creatorcontrib>LI YILIN</creatorcontrib><creatorcontrib>MA CHAOYANG</creatorcontrib><creatorcontrib>LIU XINYU</creatorcontrib><creatorcontrib>LI XIAO</creatorcontrib><creatorcontrib>SUN GUANGLEI</creatorcontrib><creatorcontrib>LIU TONG</creatorcontrib><creatorcontrib>JIANG XIAOXU</creatorcontrib><creatorcontrib>LI XUXU</creatorcontrib><creatorcontrib>PANG SUMIN</creatorcontrib><creatorcontrib>TAN CHUANLIANG</creatorcontrib><creatorcontrib>LI ZHIHE</creatorcontrib><creatorcontrib>HU JINXI</creatorcontrib><creatorcontrib>YANG FAN</creatorcontrib><creatorcontrib>WU TIANYI</creatorcontrib><creatorcontrib>LI YONGLIN</creatorcontrib><creatorcontrib>ZHAO XIAOMIN</creatorcontrib><creatorcontrib>WANG QILONG</creatorcontrib><creatorcontrib>ZHANG HANG</creatorcontrib><creatorcontrib>GAO FANG</creatorcontrib><creatorcontrib>LIU WENKUI</creatorcontrib><title>Temperature difference energy taking cooling device</title><description>The invention discloses a temperature difference energy-taking cooling device, and belongs to the field of embedded power equipment.The temperature difference energy-taking cooling device firstly obtains heat energy of a chip to be cooled through a temperature difference energy-taking module to supply power to a sensing module and a temperature regulation and control module; and secondly, the temperature regulation and control module regulates and controls the temperature of the chip to be cooled according to the data collected by the sensing module so as to realize regulation and control of the chip to be cooled. Wherein the temperature difference energy taking module directly faces the upper portion of the chip and can take energy to the maximum extent, and the temperature difference energy taking module can switch the position at any time by arranging the supporting frame so as to obtain heat energy of different chips. Temperature difference energy taking can be flexibly switched through the supporting fra</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERATION</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAOSc0tSC1KLCktSlVIyUxLSy1KzUtOVUjNSy1Kr1QoSczOzEtXSM7PzwHRKallmcmpPAysaYk5xam8UJqbQdHNNcTZQze1ID8-tbggMRmouyTe2c_Q0NzC0ABIOBoTowYAJMksug</recordid><startdate>20240402</startdate><enddate>20240402</enddate><creator>LIU QING</creator><creator>HE LIN</creator><creator>FAN MEIQI</creator><creator>LIN XIN</creator><creator>BI YINGHUA</creator><creator>GUAN XIN</creator><creator>XU JIYUAN</creator><creator>LI YILIN</creator><creator>MA CHAOYANG</creator><creator>LIU XINYU</creator><creator>LI XIAO</creator><creator>SUN GUANGLEI</creator><creator>LIU TONG</creator><creator>JIANG XIAOXU</creator><creator>LI XUXU</creator><creator>PANG SUMIN</creator><creator>TAN CHUANLIANG</creator><creator>LI ZHIHE</creator><creator>HU JINXI</creator><creator>YANG FAN</creator><creator>WU TIANYI</creator><creator>LI YONGLIN</creator><creator>ZHAO XIAOMIN</creator><creator>WANG QILONG</creator><creator>ZHANG HANG</creator><creator>GAO FANG</creator><creator>LIU WENKUI</creator><scope>EVB</scope></search><sort><creationdate>20240402</creationdate><title>Temperature difference energy taking cooling device</title><author>LIU QING ; 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and secondly, the temperature regulation and control module regulates and controls the temperature of the chip to be cooled according to the data collected by the sensing module so as to realize regulation and control of the chip to be cooled. Wherein the temperature difference energy taking module directly faces the upper portion of the chip and can take energy to the maximum extent, and the temperature difference energy taking module can switch the position at any time by arranging the supporting frame so as to obtain heat energy of different chips. Temperature difference energy taking can be flexibly switched through the supporting fra</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION SEMICONDUCTOR DEVICES |
| title | Temperature difference energy taking cooling device |
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