Photosensitive polyimide resin composition as well as preparation method and application thereof

The invention discloses a photosensitive polyimide resin composition as well as a preparation method and application thereof. The composition comprises the following components in parts by mass: 100 parts of photosensitive polyamic acid ester resin, a low-temperature curing accelerator and alkali-so...

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Bibliographische Detailangaben
Hauptverfasser:	LYU XIALEI, ZHANG GUOPING, LI JINHUI, SUN RONG, LAI XINGWANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES APPARATUS SPECIALLY ADAPTED THEREFOR CHEMICAL PAINT OR INK REMOVERS CHEMISTRY CINEMATOGRAPHY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES ELECTROGRAPHY FILLING PASTES HOLOGRAPHY INKS MATERIALS THEREFOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORIGINALS THEREFOR PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS POLISHES USE OF MATERIALS THEREFOR WOODSTAINS
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