Method for processing resin substrate
The invention provides a processing method of a resin substrate, and when the resin substrate is divided into chips, convex parts on the periphery do not become hinders. The method for processing the resin substrate comprises the following steps: a holding step of holding the resin substrate (20) on...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | OHMAE MAKIKO |
| description | The invention provides a processing method of a resin substrate, and when the resin substrate is divided into chips, convex parts on the periphery do not become hinders. The method for processing the resin substrate comprises the following steps: a holding step of holding the resin substrate (20) on a chuck table (10a); a convex portion flattening step of positioning a cutting blade (83) on the outer periphery (22) of the resin substrate (20) and cutting the convex portions (23a-23d) so that the heights of the convex portions (23a-23d) are substantially the same as the height of the central flat portion (21); and a dividing step in which the X-axis feeding unit and the Y-axis feeding unit are operated to divide the resin substrate (20) into individual chips (24).
本发明提供树脂基板的加工方法，在将树脂基板分割成各个芯片时，外周的凸部不会成为妨碍。该树脂基板的加工方法构成为包含如下的工序：保持工序，将树脂基板(20)保持于卡盘工作台(10a)；凸部平坦化工序，将切削刀具(83)定位于树脂基板(20)的外周(22)，对凸部(23a～23d)进行切削而使凸部(23a～23d)的高度与中央平坦部(21)的高度大致相同；以及分割工序，使X轴进给单元和Y轴进给单元进行动作而将树脂基板(20)分割成各个芯片(24)。 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN117790419A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN117790419A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN117790419A3</originalsourceid><addsrcrecordid>eNrjZFD1TS3JyE9RSMsvUigoyk9OLS7OzEtXKEoFUgrFpUnFJUWJJak8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61uCAxOTUvtSTe2c_Q0Nzc0sDE0NLRmBg1AFnXJ30</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method for processing resin substrate</title><source>esp@cenet</source><creator>OHMAE MAKIKO</creator><creatorcontrib>OHMAE MAKIKO</creatorcontrib><description>The invention provides a processing method of a resin substrate, and when the resin substrate is divided into chips, convex parts on the periphery do not become hinders. The method for processing the resin substrate comprises the following steps: a holding step of holding the resin substrate (20) on a chuck table (10a); a convex portion flattening step of positioning a cutting blade (83) on the outer periphery (22) of the resin substrate (20) and cutting the convex portions (23a-23d) so that the heights of the convex portions (23a-23d) are substantially the same as the height of the central flat portion (21); and a dividing step in which the X-axis feeding unit and the Y-axis feeding unit are operated to divide the resin substrate (20) into individual chips (24).
本发明提供树脂基板的加工方法，在将树脂基板分割成各个芯片时，外周的凸部不会成为妨碍。该树脂基板的加工方法构成为包含如下的工序：保持工序，将树脂基板(20)保持于卡盘工作台(10a)；凸部平坦化工序，将切削刀具(83)定位于树脂基板(20)的外周(22)，对凸部(23a～23d)进行切削而使凸部(23a～23d)的高度与中央平坦部(21)的高度大致相同；以及分割工序，使X轴进给单元和Y轴进给单元进行动作而将树脂基板(20)分割成各个芯片(24)。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; TRANSPORTING ; WORKING CEMENT, CLAY, OR STONE ; WORKING STONE OR STONE-LIKE MATERIALS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240329&DB=EPODOC&CC=CN&NR=117790419A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240329&DB=EPODOC&CC=CN&NR=117790419A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OHMAE MAKIKO</creatorcontrib><title>Method for processing resin substrate</title><description>The invention provides a processing method of a resin substrate, and when the resin substrate is divided into chips, convex parts on the periphery do not become hinders. The method for processing the resin substrate comprises the following steps: a holding step of holding the resin substrate (20) on a chuck table (10a); a convex portion flattening step of positioning a cutting blade (83) on the outer periphery (22) of the resin substrate (20) and cutting the convex portions (23a-23d) so that the heights of the convex portions (23a-23d) are substantially the same as the height of the central flat portion (21); and a dividing step in which the X-axis feeding unit and the Y-axis feeding unit are operated to divide the resin substrate (20) into individual chips (24).
本发明提供树脂基板的加工方法，在将树脂基板分割成各个芯片时，外周的凸部不会成为妨碍。该树脂基板的加工方法构成为包含如下的工序：保持工序，将树脂基板(20)保持于卡盘工作台(10a)；凸部平坦化工序，将切削刀具(83)定位于树脂基板(20)的外周(22)，对凸部(23a～23d)进行切削而使凸部(23a～23d)的高度与中央平坦部(21)的高度大致相同；以及分割工序，使X轴进给单元和Y轴进给单元进行动作而将树脂基板(20)分割成各个芯片(24)。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><subject>WORKING CEMENT, CLAY, OR STONE</subject><subject>WORKING STONE OR STONE-LIKE MATERIALS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD1TS3JyE9RSMsvUigoyk9OLS7OzEtXKEoFUgrFpUnFJUWJJak8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61uCAxOTUvtSTe2c_Q0Nzc0sDE0NLRmBg1AFnXJ30</recordid><startdate>20240329</startdate><enddate>20240329</enddate><creator>OHMAE MAKIKO</creator><scope>EVB</scope></search><sort><creationdate>20240329</creationdate><title>Method for processing resin substrate</title><author>OHMAE MAKIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117790419A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><topic>WORKING CEMENT, CLAY, OR STONE</topic><topic>WORKING STONE OR STONE-LIKE MATERIALS</topic><toplevel>online_resources</toplevel><creatorcontrib>OHMAE MAKIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OHMAE MAKIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for processing resin substrate</title><date>2024-03-29</date><risdate>2024</risdate><abstract>The invention provides a processing method of a resin substrate, and when the resin substrate is divided into chips, convex parts on the periphery do not become hinders. The method for processing the resin substrate comprises the following steps: a holding step of holding the resin substrate (20) on a chuck table (10a); a convex portion flattening step of positioning a cutting blade (83) on the outer periphery (22) of the resin substrate (20) and cutting the convex portions (23a-23d) so that the heights of the convex portions (23a-23d) are substantially the same as the height of the central flat portion (21); and a dividing step in which the X-axis feeding unit and the Y-axis feeding unit are operated to divide the resin substrate (20) into individual chips (24).
本发明提供树脂基板的加工方法，在将树脂基板分割成各个芯片时，外周的凸部不会成为妨碍。该树脂基板的加工方法构成为包含如下的工序：保持工序，将树脂基板(20)保持于卡盘工作台(10a)；凸部平坦化工序，将切削刀具(83)定位于树脂基板(20)的外周(22)，对凸部(23a～23d)进行切削而使凸部(23a～23d)的高度与中央平坦部(21)的高度大致相同；以及分割工序，使X轴进给单元和Y轴进给单元进行动作而将树脂基板(20)分割成各个芯片(24)。</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN117790419A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS |
| title | Method for processing resin substrate |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-12T07%3A46%3A25IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=OHMAE%20MAKIKO&rft.date=2024-03-29&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN117790419A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |