Method for improving packaging creepage distance

The present disclosure relates to a semiconductor package and a method of improving creepage of the semiconductor package, where the package comprises a semiconductor device and a plurality of conductive contacts at a surface of the package, the package comprising an insulating material for electrically insulating the package between the plurality of conductive contacts, wherein the initial creepage distance is defined by a shortest distance on the surface of the package between two of the plurality of contacts, and the method comprises the steps of applying a layer of insulating material on at least a portion of at least one of the two contacts, wherein an insulating material is applied in a thin layer and selected to achieve a package thermal resistance increase by less than 3 times compared to an uncoated semiconductor package, thereby increasing an initial creepage distance and improving package creepage of the semiconductor package. 本公开涉及一种半导体封装以及改进半导体封装爬电的方法，其中该封装包括半导体器件和在封装的表面处的多个导电接触，该封装包括用于使封装在多个导电接触