ETPU foaming sole forming method

The invention provides an ETPU foaming sole forming method. The ETPU foaming sole forming method comprises the steps that S1, a mold is subjected to primary mold closing; a closed forming die cavity is formed between the upper die and the lower die, and an extrusion seam is reserved; step S2, sole f...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	PAN ZHIXIAN, HUANG YANGLING, HUANG YUHAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The invention provides an ETPU foaming sole forming method. The ETPU foaming sole forming method comprises the steps that S1, a mold is subjected to primary mold closing; a closed forming die cavity is formed between the upper die and the lower die, and an extrusion seam is reserved; step S2, sole foaming; the forming die cavity is filled with the ETPU foaming particles, the ETPU foaming particles are heated to be bonded to form the foaming shoe sole, and the surfaces of the ETPU foaming particles are molten to form a bonding substance; s3, secondary mold closing is conducted on the mold; the upper mold and the lower mold tightly abut against each other to jointly compact the foamed shoe sole, and bonding substances on the surfaces of the ETPU foamed particles are gathered on the inner wall of the forming mold cavity; s4, heating the mold, and raising the temperature to polymerize bonding substances on the surfaces of the adjacent ETPU foaming particles; s5, cooling and shaping, wherein the bonding substance