FPC (Flexible Printed Circuit) dispensing and curing integrated processing method and equipment
The invention discloses an FPC dispensing and curing integrated processing method and equipment, and relates to the technical field of FPC processing, the equipment comprises a main body, the equipment main body comprises a UV furnace and a dispensing operation table, the dispensing operation table...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | WEI WENJIN PENG YUAN LIN WUJIE |
| description | The invention discloses an FPC dispensing and curing integrated processing method and equipment, and relates to the technical field of FPC processing, the equipment comprises a main body, the equipment main body comprises a UV furnace and a dispensing operation table, the dispensing operation table is located on the front side, and the UV furnace is located on the rear side, the equipment main body is characterized in that a dispensing assembly is arranged on the UV furnace, a placement table control assembly is further arranged on the UV furnace, and the placement table control assembly is located on the placement table control assembly; a placing table assembly is arranged on the placing table control assembly, the placing table control assembly is connected with the feeding assembly, and the feeding assembly is arranged in a feeding groove in the glue dispensing operation table. The device is applied to the high-precision rapid dispensing process, the FPC can be directly fed into the UV furnace for curing |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN117772559A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN117772559A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN117772559A3</originalsourceid><addsrcrecordid>eNqNyrEKwjAURuEsDqK-w3XTwaFKCY4SLE7SwT3E5G-90KYxScHHlxYfwOmc4VsKXdWKdlWHDz87UB3ZZzhSHO3IeU-OU4BP7Fsy3pEd47QTaqOZZIiDRZpBj_wa3OzwHjn08HktFo3pEja_rsS2uj7U7YAwaKRgLDyyVveikFIey_J8Of1jvhYoPJs</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>FPC (Flexible Printed Circuit) dispensing and curing integrated processing method and equipment</title><source>esp@cenet</source><creator>WEI WENJIN ; PENG YUAN ; LIN WUJIE</creator><creatorcontrib>WEI WENJIN ; PENG YUAN ; LIN WUJIE</creatorcontrib><description>The invention discloses an FPC dispensing and curing integrated processing method and equipment, and relates to the technical field of FPC processing, the equipment comprises a main body, the equipment main body comprises a UV furnace and a dispensing operation table, the dispensing operation table is located on the front side, and the UV furnace is located on the rear side, the equipment main body is characterized in that a dispensing assembly is arranged on the UV furnace, a placement table control assembly is further arranged on the UV furnace, and the placement table control assembly is located on the placement table control assembly; a placing table assembly is arranged on the placing table control assembly, the placing table control assembly is connected with the feeding assembly, and the feeding assembly is arranged in a feeding groove in the glue dispensing operation table. The device is applied to the high-precision rapid dispensing process, the FPC can be directly fed into the UV furnace for curing</description><language>chi ; eng</language><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; PERFORMING OPERATIONS ; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240329&DB=EPODOC&CC=CN&NR=117772559A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240329&DB=EPODOC&CC=CN&NR=117772559A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WEI WENJIN</creatorcontrib><creatorcontrib>PENG YUAN</creatorcontrib><creatorcontrib>LIN WUJIE</creatorcontrib><title>FPC (Flexible Printed Circuit) dispensing and curing integrated processing method and equipment</title><description>The invention discloses an FPC dispensing and curing integrated processing method and equipment, and relates to the technical field of FPC processing, the equipment comprises a main body, the equipment main body comprises a UV furnace and a dispensing operation table, the dispensing operation table is located on the front side, and the UV furnace is located on the rear side, the equipment main body is characterized in that a dispensing assembly is arranged on the UV furnace, a placement table control assembly is further arranged on the UV furnace, and the placement table control assembly is located on the placement table control assembly; a placing table assembly is arranged on the placing table control assembly, the placing table control assembly is connected with the feeding assembly, and the feeding assembly is arranged in a feeding groove in the glue dispensing operation table. The device is applied to the high-precision rapid dispensing process, the FPC can be directly fed into the UV furnace for curing</description><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAURuEsDqK-w3XTwaFKCY4SLE7SwT3E5G-90KYxScHHlxYfwOmc4VsKXdWKdlWHDz87UB3ZZzhSHO3IeU-OU4BP7Fsy3pEd47QTaqOZZIiDRZpBj_wa3OzwHjn08HktFo3pEja_rsS2uj7U7YAwaKRgLDyyVveikFIey_J8Of1jvhYoPJs</recordid><startdate>20240329</startdate><enddate>20240329</enddate><creator>WEI WENJIN</creator><creator>PENG YUAN</creator><creator>LIN WUJIE</creator><scope>EVB</scope></search><sort><creationdate>20240329</creationdate><title>FPC (Flexible Printed Circuit) dispensing and curing integrated processing method and equipment</title><author>WEI WENJIN ; PENG YUAN ; LIN WUJIE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117772559A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>WEI WENJIN</creatorcontrib><creatorcontrib>PENG YUAN</creatorcontrib><creatorcontrib>LIN WUJIE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WEI WENJIN</au><au>PENG YUAN</au><au>LIN WUJIE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FPC (Flexible Printed Circuit) dispensing and curing integrated processing method and equipment</title><date>2024-03-29</date><risdate>2024</risdate><abstract>The invention discloses an FPC dispensing and curing integrated processing method and equipment, and relates to the technical field of FPC processing, the equipment comprises a main body, the equipment main body comprises a UV furnace and a dispensing operation table, the dispensing operation table is located on the front side, and the UV furnace is located on the rear side, the equipment main body is characterized in that a dispensing assembly is arranged on the UV furnace, a placement table control assembly is further arranged on the UV furnace, and the placement table control assembly is located on the placement table control assembly; a placing table assembly is arranged on the placing table control assembly, the placing table control assembly is connected with the feeding assembly, and the feeding assembly is arranged in a feeding groove in the glue dispensing operation table. The device is applied to the high-precision rapid dispensing process, the FPC can be directly fed into the UV furnace for curing</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN117772559A |
| source | esp@cenet |
| subjects | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
| title | FPC (Flexible Printed Circuit) dispensing and curing integrated processing method and equipment |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-19T04%3A44%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WEI%20WENJIN&rft.date=2024-03-29&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN117772559A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |