ANTENNA UNIT AND METHOD OF MANUFACTURING ANTENNA UNIT

According to a first aspect of the present disclosure, there is provided an antenna unit comprising: an integrated circuit package comprising an integrated circuit die and an antenna structure coupled to the integrated circuit die; a semiconductor device includes an integrated circuit package, a dielectric layer separated from the integrated circuit package, where the dielectric layer is disposed over an upper surface of the integrated circuit package at a predefined distance. According to a second aspect of the present disclosure, a corresponding method of manufacturing an antenna unit is conceived. 根据本公开的第一方面，提供一种天线单元，所述天线单元包括：集成电路封装，所述集成电路封装包含集成电路管芯和耦合到所述集成电路管芯的天线结构；介电层，所述介电层与所述集成电路封装分离，其中所述介电层以预定义距离放置在所述集成电路封装的上部表面上方。根据本公开的第二方面，构想一种制造天线单元的对应方法。