Monitoring surface oxides on seed layers during electroplating

Methods and apparatus for determining whether a substrate includes an unacceptable mass of oxide on a surface of the substrate are described. The substrate is typically a substrate to be electroplated. The determination may be made directly in the electroplating apparatus during an initial portion of the electroplating process. The determination may include immersing the substrate in an electrolyte having a particular applied voltage or applied current provided during or immediately after immersion, and recording a current response or voltage response over the same time range. The applied current or voltage may be zero or non-zero. By comparing the current response or the voltage response to a threshold current, a threshold voltage, or a threshold time, it can be determined whether the substrate contains an unacceptable large amount of oxide on its surface. A threshold current, a threshold voltage, and/or a threshold time may be selected based on a calibration procedure. 描述了用于确定衬底是否包括在该衬底的表面上的不可接受的大量氧化物的方法和设备