Method for reducing electric leakage proportion of anode glass fiber filament in PCB (printed circuit board) hole
The invention discloses a method for reducing the electric leakage proportion of anode glass fiber filaments in PCB holes, and relates to the technical field of PCBs, and the method comprises the following steps: a three-section type drill bit is used for drilling a PCB block, and the three-section...
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| creator | KIM SAE-YONG SHU SHIQUAN LIU LONGTAN WANG TIANWEN LI MIN RAO ZHIQIANG |
| description | The invention discloses a method for reducing the electric leakage proportion of anode glass fiber filaments in PCB holes, and relates to the technical field of PCBs, and the method comprises the following steps: a three-section type drill bit is used for drilling a PCB block, and the three-section type drill bit is divided into a drilling section, a cleaning section and a coating section from bottom to top; after the drilling section of the three-section type drill bit is drilled into the plate to form a drilled hole, the drill bit continues to move downwards, so that the cleaning section enters the hole to clean the hole wall, and then the drill bit continues to move downwards, so that the coating section enters the hole to coat the hole wall with the graphene solution; after drying and micro-etching, copper electroplating is finally carried out; the PCB does not need to be soaked and cleaned in an acidic or alkaline solution, so that the situation that molecular-level copper salt permeates into gaps betwee |
| format | Patent |
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after the drilling section of the three-section type drill bit is drilled into the plate to form a drilled hole, the drill bit continues to move downwards, so that the cleaning section enters the hole to clean the hole wall, and then the drill bit continues to move downwards, so that the coating section enters the hole to coat the hole wall with the graphene solution; after drying and micro-etching, copper electroplating is finally carried out; the PCB does not need to be soaked and cleaned in an acidic or alkaline solution, so that the situation that molecular-level copper salt permeates into gaps betwee</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Method for reducing electric leakage proportion of anode glass fiber filament in PCB (printed circuit board) hole |
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