Passivation contact structure with selective tunneling layer thickness and preparation method and application thereof

The invention discloses a passivation contact structure with a selective tunneling layer thickness and a preparation method and application thereof. During preparation, a first tunneling silicon oxide layer is deposited on the back surface of a silicon substrate and covered with a compact cover plat...

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Hauptverfasser: HUANG SHENHU, YE HUAN, XIAO CHEN, XIAO ZAN, SHEN DONGDONG, LI YANTONG
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creator HUANG SHENHU
YE HUAN
XIAO CHEN
XIAO ZAN
SHEN DONGDONG
LI YANTONG
description The invention discloses a passivation contact structure with a selective tunneling layer thickness and a preparation method and application thereof. During preparation, a first tunneling silicon oxide layer is deposited on the back surface of a silicon substrate and covered with a compact cover plate with a gap structure, and the gap structure corresponds to a non-metal contact area; the part except the gap structure corresponds to the metal contact area; then depositing a second tunneling silicon oxide layer, wherein the gap structure can allow the second tunneling silicon oxide layer to be deposited in the non-metal contact region; removing the compact cover plate, depositing an amorphous silicon layer, and carrying out annealing treatment to form a phosphorus-doped polycrystalline silicon layer; according to the passivation contact structure manufactured through the method, a thin tunneling oxide layer structure is achieved in the metal contact area, a thick tunneling oxide layer structure obtained through
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Passivation contact structure with selective tunneling layer thickness and preparation method and application thereof
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