Method for analyzing plating leakage reason of aluminum-silicon plating layer taking stainless steel as substrate
The invention relates to a method for analyzing plating leakage reasons of an aluminum-silicon coating with stainless steel as a substrate, which comprises the following steps: (1) taking a zinc-aluminum-magnesium coating steel plate, and shearing a sample; (2) breaking the plating layer and the sub...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a method for analyzing plating leakage reasons of an aluminum-silicon coating with stainless steel as a substrate, which comprises the following steps: (1) taking a zinc-aluminum-magnesium coating steel plate, and shearing a sample; (2) breaking the plating layer and the substrate through a cup drawing test; (3) wrapping the sample treated in the step (2) with a preservative film, cutting a convex part, covering a plating layer with a conductive adhesive, applying pressure, and peeling off the conductive adhesive to realize the stripping of the plating layer and the substrate; and (4) observing through a scanning electron microscope, and determining the nature through an energy disperse spectroscopy. According to the method, a new method for analyzing the plating leakage reason is created, the original method that the plating leakage reason cannot be determined through cross section metallographic phase and surface direct detection is broken, the plating layer and the base body can be |
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