Laser packaging structure

The invention relates to a laser packaging structure. The laser packaging structure comprises an insulating substrate, an annular bracket, an electrode layer, an edge emission chip and a reflector, the annular support is arranged on the insulating substrate, and the annular support and the insulatin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LI CHUYI, ZHANG JINHUI, LI HONGHAO, KUANG XIANFENG, WANG TIEZHU, LAN MINGWEN, LIANG LIFANG, ZHENG YINLING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRICITY
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