Laser packaging structure
The invention relates to a laser packaging structure. The laser packaging structure comprises an insulating substrate, an annular bracket, an electrode layer, an edge emission chip and a reflector, the annular support is arranged on the insulating substrate, and the annular support and the insulatin...
Gespeichert in:
| Hauptverfasser: | , , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | LI CHUYI ZHANG JINHUI LI HONGHAO KUANG XIANFENG WANG TIEZHU LAN MINGWEN LIANG LIFANG ZHENG YINLING |
| description | The invention relates to a laser packaging structure. The laser packaging structure comprises an insulating substrate, an annular bracket, an electrode layer, an edge emission chip and a reflector, the annular support is arranged on the insulating substrate, and the annular support and the insulating substrate form a cup-shaped structure with an upper opening. The electrode layer is arranged on the front face, located in the annular support, of the insulating substrate, and a chip area and an electrode area which are insulated from each other are formed. The edge emission chip is arranged on the chip area of the electrode layer, the reflector is arranged on the front face of the insulating substrate, and the mirror face of the reflector faces the light emission face of the edge emission chip. The laser packaging structure has the advantages that the heat dissipation effect is good, the manufacturing yield is high, the chip vertically emits light, and downstream customers can conveniently carry out surface mou |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN117691456A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN117691456A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN117691456A3</originalsourceid><addsrcrecordid>eNrjZJD0SSxOLVIoSEzOTkzPzEtXKC4pKk0uKS1K5WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcVAHal5qSXxzn6GhuZmloYmpmaOxsSoAQAuJSLd</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Laser packaging structure</title><source>esp@cenet</source><creator>LI CHUYI ; ZHANG JINHUI ; LI HONGHAO ; KUANG XIANFENG ; WANG TIEZHU ; LAN MINGWEN ; LIANG LIFANG ; ZHENG YINLING</creator><creatorcontrib>LI CHUYI ; ZHANG JINHUI ; LI HONGHAO ; KUANG XIANFENG ; WANG TIEZHU ; LAN MINGWEN ; LIANG LIFANG ; ZHENG YINLING</creatorcontrib><description>The invention relates to a laser packaging structure. The laser packaging structure comprises an insulating substrate, an annular bracket, an electrode layer, an edge emission chip and a reflector, the annular support is arranged on the insulating substrate, and the annular support and the insulating substrate form a cup-shaped structure with an upper opening. The electrode layer is arranged on the front face, located in the annular support, of the insulating substrate, and a chip area and an electrode area which are insulated from each other are formed. The edge emission chip is arranged on the chip area of the electrode layer, the reflector is arranged on the front face of the insulating substrate, and the mirror face of the reflector faces the light emission face of the edge emission chip. The laser packaging structure has the advantages that the heat dissipation effect is good, the manufacturing yield is high, the chip vertically emits light, and downstream customers can conveniently carry out surface mou</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; DEVICES USING STIMULATED EMISSION ; ELECTRICITY</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240312&DB=EPODOC&CC=CN&NR=117691456A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240312&DB=EPODOC&CC=CN&NR=117691456A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LI CHUYI</creatorcontrib><creatorcontrib>ZHANG JINHUI</creatorcontrib><creatorcontrib>LI HONGHAO</creatorcontrib><creatorcontrib>KUANG XIANFENG</creatorcontrib><creatorcontrib>WANG TIEZHU</creatorcontrib><creatorcontrib>LAN MINGWEN</creatorcontrib><creatorcontrib>LIANG LIFANG</creatorcontrib><creatorcontrib>ZHENG YINLING</creatorcontrib><title>Laser packaging structure</title><description>The invention relates to a laser packaging structure. The laser packaging structure comprises an insulating substrate, an annular bracket, an electrode layer, an edge emission chip and a reflector, the annular support is arranged on the insulating substrate, and the annular support and the insulating substrate form a cup-shaped structure with an upper opening. The electrode layer is arranged on the front face, located in the annular support, of the insulating substrate, and a chip area and an electrode area which are insulated from each other are formed. The edge emission chip is arranged on the chip area of the electrode layer, the reflector is arranged on the front face of the insulating substrate, and the mirror face of the reflector faces the light emission face of the edge emission chip. The laser packaging structure has the advantages that the heat dissipation effect is good, the manufacturing yield is high, the chip vertically emits light, and downstream customers can conveniently carry out surface mou</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DEVICES USING STIMULATED EMISSION</subject><subject>ELECTRICITY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJD0SSxOLVIoSEzOTkzPzEtXKC4pKk0uKS1K5WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcVAHal5qSXxzn6GhuZmloYmpmaOxsSoAQAuJSLd</recordid><startdate>20240312</startdate><enddate>20240312</enddate><creator>LI CHUYI</creator><creator>ZHANG JINHUI</creator><creator>LI HONGHAO</creator><creator>KUANG XIANFENG</creator><creator>WANG TIEZHU</creator><creator>LAN MINGWEN</creator><creator>LIANG LIFANG</creator><creator>ZHENG YINLING</creator><scope>EVB</scope></search><sort><creationdate>20240312</creationdate><title>Laser packaging structure</title><author>LI CHUYI ; ZHANG JINHUI ; LI HONGHAO ; KUANG XIANFENG ; WANG TIEZHU ; LAN MINGWEN ; LIANG LIFANG ; ZHENG YINLING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117691456A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DEVICES USING STIMULATED EMISSION</topic><topic>ELECTRICITY</topic><toplevel>online_resources</toplevel><creatorcontrib>LI CHUYI</creatorcontrib><creatorcontrib>ZHANG JINHUI</creatorcontrib><creatorcontrib>LI HONGHAO</creatorcontrib><creatorcontrib>KUANG XIANFENG</creatorcontrib><creatorcontrib>WANG TIEZHU</creatorcontrib><creatorcontrib>LAN MINGWEN</creatorcontrib><creatorcontrib>LIANG LIFANG</creatorcontrib><creatorcontrib>ZHENG YINLING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LI CHUYI</au><au>ZHANG JINHUI</au><au>LI HONGHAO</au><au>KUANG XIANFENG</au><au>WANG TIEZHU</au><au>LAN MINGWEN</au><au>LIANG LIFANG</au><au>ZHENG YINLING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Laser packaging structure</title><date>2024-03-12</date><risdate>2024</risdate><abstract>The invention relates to a laser packaging structure. The laser packaging structure comprises an insulating substrate, an annular bracket, an electrode layer, an edge emission chip and a reflector, the annular support is arranged on the insulating substrate, and the annular support and the insulating substrate form a cup-shaped structure with an upper opening. The electrode layer is arranged on the front face, located in the annular support, of the insulating substrate, and a chip area and an electrode area which are insulated from each other are formed. The edge emission chip is arranged on the chip area of the electrode layer, the reflector is arranged on the front face of the insulating substrate, and the mirror face of the reflector faces the light emission face of the edge emission chip. The laser packaging structure has the advantages that the heat dissipation effect is good, the manufacturing yield is high, the chip vertically emits light, and downstream customers can conveniently carry out surface mou</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN117691456A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRICITY |
| title | Laser packaging structure |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T15%3A37%3A41IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LI%20CHUYI&rft.date=2024-03-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN117691456A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |