Formation method of semiconductor device

The invention provides a method for forming a semiconductor device, which comprises the following steps of: providing a substrate, and forming an initial connection layer on the substrate; flattening the initial connection layer, and forming a connection layer on the substrate; performing heat treat...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WU YUPING, ZHENG ZUDI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!