Photoresist coating monitoring method and equipment thereof
The invention discloses a photoresist coating monitoring method and equipment thereof. In order to guarantee the process quality index, monitoring and analysis means based on machine vision are adopted in the photoresist coating process, and the coating uniformity of the photoresist on the substrate...
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| creator | FENG YANAN ZHAO PENG YU WENDA HU XUEJIAN HE JIANGHUI WANG BAOXING GUO JIN |
| description | The invention discloses a photoresist coating monitoring method and equipment thereof. In order to guarantee the process quality index, monitoring and analysis means based on machine vision are adopted in the photoresist coating process, and the coating uniformity of the photoresist on the substrate can be detected in real time by performing imaging shooting and executing image analysis on the substrate coated with the photoresist, so that the quality problem caused by non-uniform coating is avoided; the thickness of the photoresist is visually measured and fed back to a control system in time, so that the coating thickness is accurately controlled, and the consistency and the stability of a product are improved; and through an image analysis technology, defects such as bubbles and particle doping in a photoresist coating process can be detected and found, so that defective products are prevented from entering a subsequent process flow.
本发明公开了一种光刻胶涂覆监测方法及其设备。为了保证工艺质量指标，本发明在光刻胶涂覆工序中采用基于机器视觉的监测、分析手段，通过对光刻胶涂覆后的基 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN117666286A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN117666286A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN117666286A3</originalsourceid><addsrcrecordid>eNrjZLAOyMgvyS9KLc4sLlFIzk8sycxLV8jNz8sECoKZqSUZ-SkKiXkpCqmFpZkFual5JQolGalFqflpPAysaYk5xam8UJqbQdHNNcTZQze1ID8-tbggMTk1L7Uk3tnP0NDczMzMyMLM0ZgYNQAPVzBA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Photoresist coating monitoring method and equipment thereof</title><source>esp@cenet</source><creator>FENG YANAN ; ZHAO PENG ; YU WENDA ; HU XUEJIAN ; HE JIANGHUI ; WANG BAOXING ; GUO JIN</creator><creatorcontrib>FENG YANAN ; ZHAO PENG ; YU WENDA ; HU XUEJIAN ; HE JIANGHUI ; WANG BAOXING ; GUO JIN</creatorcontrib><description>The invention discloses a photoresist coating monitoring method and equipment thereof. In order to guarantee the process quality index, monitoring and analysis means based on machine vision are adopted in the photoresist coating process, and the coating uniformity of the photoresist on the substrate can be detected in real time by performing imaging shooting and executing image analysis on the substrate coated with the photoresist, so that the quality problem caused by non-uniform coating is avoided; the thickness of the photoresist is visually measured and fed back to a control system in time, so that the coating thickness is accurately controlled, and the consistency and the stability of a product are improved; and through an image analysis technology, defects such as bubbles and particle doping in a photoresist coating process can be detected and found, so that defective products are prevented from entering a subsequent process flow.
本发明公开了一种光刻胶涂覆监测方法及其设备。为了保证工艺质量指标，本发明在光刻胶涂覆工序中采用基于机器视觉的监测、分析手段，通过对光刻胶涂覆后的基</description><language>chi ; eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CALCULATING ; CINEMATOGRAPHY ; COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS ; COMPUTING ; COUNTING ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240308&DB=EPODOC&CC=CN&NR=117666286A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240308&DB=EPODOC&CC=CN&NR=117666286A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FENG YANAN</creatorcontrib><creatorcontrib>ZHAO PENG</creatorcontrib><creatorcontrib>YU WENDA</creatorcontrib><creatorcontrib>HU XUEJIAN</creatorcontrib><creatorcontrib>HE JIANGHUI</creatorcontrib><creatorcontrib>WANG BAOXING</creatorcontrib><creatorcontrib>GUO JIN</creatorcontrib><title>Photoresist coating monitoring method and equipment thereof</title><description>The invention discloses a photoresist coating monitoring method and equipment thereof. In order to guarantee the process quality index, monitoring and analysis means based on machine vision are adopted in the photoresist coating process, and the coating uniformity of the photoresist on the substrate can be detected in real time by performing imaging shooting and executing image analysis on the substrate coated with the photoresist, so that the quality problem caused by non-uniform coating is avoided; the thickness of the photoresist is visually measured and fed back to a control system in time, so that the coating thickness is accurately controlled, and the consistency and the stability of a product are improved; and through an image analysis technology, defects such as bubbles and particle doping in a photoresist coating process can be detected and found, so that defective products are prevented from entering a subsequent process flow.
本发明公开了一种光刻胶涂覆监测方法及其设备。为了保证工艺质量指标，本发明在光刻胶涂覆工序中采用基于机器视觉的监测、分析手段，通过对光刻胶涂覆后的基</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CALCULATING</subject><subject>CINEMATOGRAPHY</subject><subject>COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAOyMgvyS9KLc4sLlFIzk8sycxLV8jNz8sECoKZqSUZ-SkKiXkpCqmFpZkFual5JQolGalFqflpPAysaYk5xam8UJqbQdHNNcTZQze1ID8-tbggMTk1L7Uk3tnP0NDczMzMyMLM0ZgYNQAPVzBA</recordid><startdate>20240308</startdate><enddate>20240308</enddate><creator>FENG YANAN</creator><creator>ZHAO PENG</creator><creator>YU WENDA</creator><creator>HU XUEJIAN</creator><creator>HE JIANGHUI</creator><creator>WANG BAOXING</creator><creator>GUO JIN</creator><scope>EVB</scope></search><sort><creationdate>20240308</creationdate><title>Photoresist coating monitoring method and equipment thereof</title><author>FENG YANAN ; ZHAO PENG ; YU WENDA ; HU XUEJIAN ; HE JIANGHUI ; WANG BAOXING ; GUO JIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117666286A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CALCULATING</topic><topic>CINEMATOGRAPHY</topic><topic>COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>FENG YANAN</creatorcontrib><creatorcontrib>ZHAO PENG</creatorcontrib><creatorcontrib>YU WENDA</creatorcontrib><creatorcontrib>HU XUEJIAN</creatorcontrib><creatorcontrib>HE JIANGHUI</creatorcontrib><creatorcontrib>WANG BAOXING</creatorcontrib><creatorcontrib>GUO JIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FENG YANAN</au><au>ZHAO PENG</au><au>YU WENDA</au><au>HU XUEJIAN</au><au>HE JIANGHUI</au><au>WANG BAOXING</au><au>GUO JIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Photoresist coating monitoring method and equipment thereof</title><date>2024-03-08</date><risdate>2024</risdate><abstract>The invention discloses a photoresist coating monitoring method and equipment thereof. In order to guarantee the process quality index, monitoring and analysis means based on machine vision are adopted in the photoresist coating process, and the coating uniformity of the photoresist on the substrate can be detected in real time by performing imaging shooting and executing image analysis on the substrate coated with the photoresist, so that the quality problem caused by non-uniform coating is avoided; the thickness of the photoresist is visually measured and fed back to a control system in time, so that the coating thickness is accurately controlled, and the consistency and the stability of a product are improved; and through an image analysis technology, defects such as bubbles and particle doping in a photoresist coating process can be detected and found, so that defective products are prevented from entering a subsequent process flow.
本发明公开了一种光刻胶涂覆监测方法及其设备。为了保证工艺质量指标，本发明在光刻胶涂覆工序中采用基于机器视觉的监测、分析手段，通过对光刻胶涂覆后的基</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CALCULATING CINEMATOGRAPHY COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS COMPUTING COUNTING ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS |
| title | Photoresist coating monitoring method and equipment thereof |
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