Wiring board

A first substrate (10), a surface conductor layer (12), and a second substrate (20) of the wiring substrate are laminated in this order. The second substrate (20) uses an organic material as an insulating base material. The surface conductor layer (12) is located on the surface of the first substrat...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAMAMOTO, SENTARO, MATSUMOTO YUHEI, OKAMOTO KAZUHIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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