Circuit board assembly and manufacturing method thereof

The invention provides a circuit board assembly and a manufacturing method thereof. The circuit board assembly comprises a circuit board, an embedded wafer, a heat dissipation module and a temperature switch. The embedded wafer is embedded and electrically connected to the circuit board. The heat dissipation module is arranged on the circuit board and provided with a first electrical contact and a second electrical contact. The heat dissipation module is thermally coupled to the embedded wafer, and the first electrical contact is electrically connected with the circuit board. The temperature switch is located between at least one part of the circuit board and the second electrical contact. The temperature switch comprises a first metal layer and a second metal layer which are overlapped with each other. The first metal layer is electrically connected to the circuit board and is thermally coupled to the embedded wafer, and the thermal expansion coefficient of the first metal layer is different from that of the