Package structure
A packaging structure comprises a lead frame, at least two chips, at least one spacing layer and a plastic packaging material. The lead frame comprises a chip seat. The chip is arranged on the chip seat of the lead frame. The spacer layer is disposed between at least one of the chips and the die pad...
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| creator | YU ZHENGFU WU QIYI SHI KAIRI |
| description | A packaging structure comprises a lead frame, at least two chips, at least one spacing layer and a plastic packaging material. The lead frame comprises a chip seat. The chip is arranged on the chip seat of the lead frame. The spacer layer is disposed between at least one of the chips and the die pad. The plastic packaging material is arranged on the lead frame and covers the chip. A first minimum edge distance is arranged between one of the plurality of edges of the spacing layer and one of the plurality of edges of the chip seat, a second minimum edge distance is arranged between one of the plurality of edges of the chip and one of the edges of the chip seat, and the first minimum edge distance is larger than the second minimum edge distance. Therefore, the risk that the plastic packaging material is layered when the packaging structure is stressed can be reduced, and the spacer layer can increase the design elasticity of the packaging structure and can be used for protecting the chip from being damaged.
一种封 |
| format | Patent |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Package structure |
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