Method and system for simulating and predicting metal coverage in solution

The invention provides a method and system for simulating and predicting metal coverage in a solution, and the method comprises the steps: obtaining a first modeling parameter of target metal and a second modeling parameter of a target solution; establishing a metal surface model of the target metal...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LYU WANGYAN, HUANG ZHENG, LIANG YONGCHUN, NIE MING, YUE YINGCHAO, LUO XIAOYU, HUANG FENG, WANG LINLI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTEDFOR SPECIFIC APPLICATION FIELDS PHYSICS
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