Process gas supply module for reflow soldering and reflow soldering equipment
The invention provides a process gas supply module for reflow soldering and reflow soldering equipment. The module comprises a container, a mass flow meter, a pressure controller, a first electromagnetic valve and a second electromagnetic valve, the container is used for containing liquid raw materi...
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| creator | WANG CHANGFEI HUANG ZHANCHAO SONG TAO SHI TING LI LAIBIN ZHANG XINGGANG |
| description | The invention provides a process gas supply module for reflow soldering and reflow soldering equipment. The module comprises a container, a mass flow meter, a pressure controller, a first electromagnetic valve and a second electromagnetic valve, the container is used for containing liquid raw materials; the bottom of the input end of the container is immersed below the liquid level of the raw materials, so that the carrier gas and the raw materials in the container are mixed to form process gas; the mass flow meter is connected with one end of the container and is used for controlling the gas flow of the carrier gas input into the container or controlling the flow of the process gas output by the container; the pressure controller is connected with the other end of the container and is used for controlling the pressure of the process gas in the container; the first electromagnetic valve is used for controlling whether the process gas flows to the reflow soldering cavity from the container or not; the second e |
| format | Patent |
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The module comprises a container, a mass flow meter, a pressure controller, a first electromagnetic valve and a second electromagnetic valve, the container is used for containing liquid raw materials; the bottom of the input end of the container is immersed below the liquid level of the raw materials, so that the carrier gas and the raw materials in the container are mixed to form process gas; the mass flow meter is connected with one end of the container and is used for controlling the gas flow of the carrier gas input into the container or controlling the flow of the process gas output by the container; the pressure controller is connected with the other end of the container and is used for controlling the pressure of the process gas in the container; the first electromagnetic valve is used for controlling whether the process gas flows to the reflow soldering cavity from the container or not; the second e</description><language>chi ; eng</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240301&DB=EPODOC&CC=CN&NR=117620352A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240301&DB=EPODOC&CC=CN&NR=117620352A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WANG CHANGFEI</creatorcontrib><creatorcontrib>HUANG ZHANCHAO</creatorcontrib><creatorcontrib>SONG TAO</creatorcontrib><creatorcontrib>SHI TING</creatorcontrib><creatorcontrib>LI LAIBIN</creatorcontrib><creatorcontrib>ZHANG XINGGANG</creatorcontrib><title>Process gas supply module for reflow soldering and reflow soldering equipment</title><description>The invention provides a process gas supply module for reflow soldering and reflow soldering equipment. 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The module comprises a container, a mass flow meter, a pressure controller, a first electromagnetic valve and a second electromagnetic valve, the container is used for containing liquid raw materials; the bottom of the input end of the container is immersed below the liquid level of the raw materials, so that the carrier gas and the raw materials in the container are mixed to form process gas; the mass flow meter is connected with one end of the container and is used for controlling the gas flow of the carrier gas input into the container or controlling the flow of the process gas output by the container; the pressure controller is connected with the other end of the container and is used for controlling the pressure of the process gas in the container; the first electromagnetic valve is used for controlling whether the process gas flows to the reflow soldering cavity from the container or not; the second e</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Process gas supply module for reflow soldering and reflow soldering equipment |
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