Sensor and electronic device
The invention provides a sensor and electronic equipment, the sensor is electrically connected with an external component, the sensor comprises a packaging structure formed by a shell and a PCB, the PCB in the packaging structure is provided with a first air hole in a penetrating mode, and the first...
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| creator | WANG YOU GONG XIANHUI XIE YINGLI DANG MAOQIANG XIAO GUANGSONG SHI XINBIN |
| description | The invention provides a sensor and electronic equipment, the sensor is electrically connected with an external component, the sensor comprises a packaging structure formed by a shell and a PCB, the PCB in the packaging structure is provided with a first air hole in a penetrating mode, and the first air hole is provided with a second air hole in a penetrating mode. A first air hole is formed in the PCB, an annular bonding pad electrically connected with the external component is arranged on the PCB outside the packaging structure and located around the first air hole, a notch is formed in the annular bonding pad, and the notch and the annular bonding pad form an air flow gap between the PCB and the external component. According to the invention, the problem that external liquid or gas flows back to the interior of the chip of the sensor at present, resulting in product failure can be solved.
本发明提供一种传感器及电子设备，其中传感器，与外部元器件电连接，所述传感器包括由外壳和PCB形成的封装结构，在所述封装结构内部的PCB贯穿设置有第一气孔，其中，在所述封装结构外部的PCB上且位于所述第一气孔的周围的位置设置有与所述外部元器 |
| format | Patent |
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本发明提供一种传感器及电子设备，其中传感器，与外部元器件电连接，所述传感器包括由外壳和PCB形成的封装结构，在所述封装结构内部的PCB贯穿设置有第一气孔，其中，在所述封装结构外部的PCB上且位于所述第一气孔的周围的位置设置有与所述外部元器</description><language>chi ; eng</language><subject>ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS ; MEASURING ; MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE ; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR ; PHYSICS ; TARIFF METERING APPARATUS ; TESTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240227&DB=EPODOC&CC=CN&NR=117606521A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240227&DB=EPODOC&CC=CN&NR=117606521A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WANG YOU</creatorcontrib><creatorcontrib>GONG XIANHUI</creatorcontrib><creatorcontrib>XIE YINGLI</creatorcontrib><creatorcontrib>DANG MAOQIANG</creatorcontrib><creatorcontrib>XIAO GUANGSONG</creatorcontrib><creatorcontrib>SHI XINBIN</creatorcontrib><title>Sensor and electronic device</title><description>The invention provides a sensor and electronic equipment, the sensor is electrically connected with an external component, the sensor comprises a packaging structure formed by a shell and a PCB, the PCB in the packaging structure is provided with a first air hole in a penetrating mode, and the first air hole is provided with a second air hole in a penetrating mode. A first air hole is formed in the PCB, an annular bonding pad electrically connected with the external component is arranged on the PCB outside the packaging structure and located around the first air hole, a notch is formed in the annular bonding pad, and the notch and the annular bonding pad form an air flow gap between the PCB and the external component. According to the invention, the problem that external liquid or gas flows back to the interior of the chip of the sensor at present, resulting in product failure can be solved.
本发明提供一种传感器及电子设备，其中传感器，与外部元器件电连接，所述传感器包括由外壳和PCB形成的封装结构，在所述封装结构内部的PCB贯穿设置有第一气孔，其中，在所述封装结构外部的PCB上且位于所述第一气孔的周围的位置设置有与所述外部元器</description><subject>ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS</subject><subject>MEASURING</subject><subject>MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE</subject><subject>MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR</subject><subject>PHYSICS</subject><subject>TARIFF METERING APPARATUS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAJTs0rzi9SSMxLUUjNSU0uKcrPy0xWSEkty0xO5WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hobmZgZmpkaGjsbEqAEAlhQjog</recordid><startdate>20240227</startdate><enddate>20240227</enddate><creator>WANG YOU</creator><creator>GONG XIANHUI</creator><creator>XIE YINGLI</creator><creator>DANG MAOQIANG</creator><creator>XIAO GUANGSONG</creator><creator>SHI XINBIN</creator><scope>EVB</scope></search><sort><creationdate>20240227</creationdate><title>Sensor and electronic device</title><author>WANG YOU ; GONG XIANHUI ; XIE YINGLI ; DANG MAOQIANG ; XIAO GUANGSONG ; SHI XINBIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117606521A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS</topic><topic>MEASURING</topic><topic>MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE</topic><topic>MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR</topic><topic>PHYSICS</topic><topic>TARIFF METERING APPARATUS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>WANG YOU</creatorcontrib><creatorcontrib>GONG XIANHUI</creatorcontrib><creatorcontrib>XIE YINGLI</creatorcontrib><creatorcontrib>DANG MAOQIANG</creatorcontrib><creatorcontrib>XIAO GUANGSONG</creatorcontrib><creatorcontrib>SHI XINBIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WANG YOU</au><au>GONG XIANHUI</au><au>XIE YINGLI</au><au>DANG MAOQIANG</au><au>XIAO GUANGSONG</au><au>SHI XINBIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Sensor and electronic device</title><date>2024-02-27</date><risdate>2024</risdate><abstract>The invention provides a sensor and electronic equipment, the sensor is electrically connected with an external component, the sensor comprises a packaging structure formed by a shell and a PCB, the PCB in the packaging structure is provided with a first air hole in a penetrating mode, and the first air hole is provided with a second air hole in a penetrating mode. A first air hole is formed in the PCB, an annular bonding pad electrically connected with the external component is arranged on the PCB outside the packaging structure and located around the first air hole, a notch is formed in the annular bonding pad, and the notch and the annular bonding pad form an air flow gap between the PCB and the external component. According to the invention, the problem that external liquid or gas flows back to the interior of the chip of the sensor at present, resulting in product failure can be solved.
本发明提供一种传感器及电子设备，其中传感器，与外部元器件电连接，所述传感器包括由外壳和PCB形成的封装结构，在所述封装结构内部的PCB贯穿设置有第一气孔，其中，在所述封装结构外部的PCB上且位于所述第一气孔的周围的位置设置有与所述外部元器</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS MEASURING MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PHYSICS TARIFF METERING APPARATUS TESTING |
| title | Sensor and electronic device |
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