Power supply module

The present disclosure relates to a power module including: a substrate; a ceramic substrate bonded to the upper surface of the substrate; a semiconductor chip bonded to an upper surface of the ceramic substrate; a spacer bonded to the upper surface of the ceramic substrate, spaced apart from the semiconductor chip; a connection pin disposed at the electrode layer formed on an upper surface of the spacer; and a bonding wire for connecting the terminal of the semiconductor chip to the electrode layer of the spacer. 本公开涉及一种电源模块，包括：基板；陶瓷衬底，其接合到基板的上表面；半导体芯片，其接合到陶瓷衬底的上表面；间隔件，其接合到所述陶瓷衬底的所述上表面，与所述半导体芯片间隔开；连接销，其设置在形成于间隔件的上表面上的电极层处；以及用于将半导体芯片的端子连接到间隔件的电极层的接合线。