Microelectronic package with embedded interposer

An electronic device includes: a plurality of integrated circuit (IC) dies disposed on a package substrate having a substrate region; a mold layer comprising the IC die and a plurality of conductive pillars extending from a surface of at least one IC die to a first surface of the mold layer; and an interposer layer extending over the substrate region and including a reinforcement material that is more rigid than the material of the package substrate. The interposer layer includes a plurality of conductive through-layer vias contacting the conductive pillars at the first surface of the molding layer and extending through the reinforcement material to the second surface of the interposer layer. 一种电子装置包括：设置在具有基板区域的封装基板上的多个集成电路(IC)管芯；模制物层，其包括所述IC管芯和从至少一个IC管芯的表面延伸至所述模制物层的第一表面的多个导电柱；以及在所述基板区域之上延伸并且包括比所述封装基板的材料更具刚性的加强材料的内插器层。所述内插器层包括在模制物层的第一表面处接触导电柱并且穿过加强材料延伸至内插器层的第二表面的多个导电贯穿层过孔。