Semiconductor structure and forming method thereof

The invention discloses a semiconductor structure and a forming method thereof, and the method comprises the steps: providing a substrate which comprises an isolation region, a first device region and a second device region; a plurality of first fin parts arranged in the second direction are formed...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TU WUTAO, HAN BAOZHAI, LIU YING, DING FENG
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator TU WUTAO
HAN BAOZHAI
LIU YING
DING FENG
description The invention discloses a semiconductor structure and a forming method thereof, and the method comprises the steps: providing a substrate which comprises an isolation region, a first device region and a second device region; a plurality of first fin parts arranged in the second direction are formed on the substrate, isolation openings are formed in the first fin parts, and the isolation openings are located in the first region; a dielectric layer and a plurality of precursor structures are formed on the substrate, the precursor structures stretch across the first fin parts in the second direction, and the dielectric layer covers the side walls of the precursor structures; and performing oxidation treatment on the precursor structure located on the first region and adjacent to the isolation opening to form a first isolation structure. The first isolation structure is directly formed by oxidizing the precursor structure, and the removal process of the gate structure does not need to be carried out, so that the
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN117525068A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN117525068A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN117525068A3</originalsourceid><addsrcrecordid>eNrjZDAKTs3NTM7PSylNLskvUiguKQIySotSFRLzUhTS8otyM_PSFXJTSzLyUxRKMlKLUvPTeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoaG5qZGpgZmFozExagAPwiyi</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Semiconductor structure and forming method thereof</title><source>esp@cenet</source><creator>TU WUTAO ; HAN BAOZHAI ; LIU YING ; DING FENG</creator><creatorcontrib>TU WUTAO ; HAN BAOZHAI ; LIU YING ; DING FENG</creatorcontrib><description>The invention discloses a semiconductor structure and a forming method thereof, and the method comprises the steps: providing a substrate which comprises an isolation region, a first device region and a second device region; a plurality of first fin parts arranged in the second direction are formed on the substrate, isolation openings are formed in the first fin parts, and the isolation openings are located in the first region; a dielectric layer and a plurality of precursor structures are formed on the substrate, the precursor structures stretch across the first fin parts in the second direction, and the dielectric layer covers the side walls of the precursor structures; and performing oxidation treatment on the precursor structure located on the first region and adjacent to the isolation opening to form a first isolation structure. The first isolation structure is directly formed by oxidizing the precursor structure, and the removal process of the gate structure does not need to be carried out, so that the</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240206&amp;DB=EPODOC&amp;CC=CN&amp;NR=117525068A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240206&amp;DB=EPODOC&amp;CC=CN&amp;NR=117525068A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TU WUTAO</creatorcontrib><creatorcontrib>HAN BAOZHAI</creatorcontrib><creatorcontrib>LIU YING</creatorcontrib><creatorcontrib>DING FENG</creatorcontrib><title>Semiconductor structure and forming method thereof</title><description>The invention discloses a semiconductor structure and a forming method thereof, and the method comprises the steps: providing a substrate which comprises an isolation region, a first device region and a second device region; a plurality of first fin parts arranged in the second direction are formed on the substrate, isolation openings are formed in the first fin parts, and the isolation openings are located in the first region; a dielectric layer and a plurality of precursor structures are formed on the substrate, the precursor structures stretch across the first fin parts in the second direction, and the dielectric layer covers the side walls of the precursor structures; and performing oxidation treatment on the precursor structure located on the first region and adjacent to the isolation opening to form a first isolation structure. The first isolation structure is directly formed by oxidizing the precursor structure, and the removal process of the gate structure does not need to be carried out, so that the</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAKTs3NTM7PSylNLskvUiguKQIySotSFRLzUhTS8otyM_PSFXJTSzLyUxRKMlKLUvPTeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoaG5qZGpgZmFozExagAPwiyi</recordid><startdate>20240206</startdate><enddate>20240206</enddate><creator>TU WUTAO</creator><creator>HAN BAOZHAI</creator><creator>LIU YING</creator><creator>DING FENG</creator><scope>EVB</scope></search><sort><creationdate>20240206</creationdate><title>Semiconductor structure and forming method thereof</title><author>TU WUTAO ; HAN BAOZHAI ; LIU YING ; DING FENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117525068A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>TU WUTAO</creatorcontrib><creatorcontrib>HAN BAOZHAI</creatorcontrib><creatorcontrib>LIU YING</creatorcontrib><creatorcontrib>DING FENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TU WUTAO</au><au>HAN BAOZHAI</au><au>LIU YING</au><au>DING FENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor structure and forming method thereof</title><date>2024-02-06</date><risdate>2024</risdate><abstract>The invention discloses a semiconductor structure and a forming method thereof, and the method comprises the steps: providing a substrate which comprises an isolation region, a first device region and a second device region; a plurality of first fin parts arranged in the second direction are formed on the substrate, isolation openings are formed in the first fin parts, and the isolation openings are located in the first region; a dielectric layer and a plurality of precursor structures are formed on the substrate, the precursor structures stretch across the first fin parts in the second direction, and the dielectric layer covers the side walls of the precursor structures; and performing oxidation treatment on the precursor structure located on the first region and adjacent to the isolation opening to form a first isolation structure. The first isolation structure is directly formed by oxidizing the precursor structure, and the removal process of the gate structure does not need to be carried out, so that the</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN117525068A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Semiconductor structure and forming method thereof
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-07T17%3A10%3A02IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TU%20WUTAO&rft.date=2024-02-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN117525068A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true