Wafer and wafer manufacturing method

The invention relates to the technical field of semiconductors, and discloses a wafer, which comprises a wafer body, and the cutting groove is formed in the wafer body along the cutting channel of the wafer body. The cutting grooves are formed in the cutting channels of the wafer body. Due to the fa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LI KAILIANG, ZHENG PUGUANG, ZHANG JUANRONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!