High-precision nano soldering paste and preparation method thereof
The invention discloses high-precision nano soldering paste and a preparation method thereof, and particularly relates to the technical field of nano soldering paste preparation. Comprising the following components in parts by weight: 4-6 parts of soldering tin powder, 2-5 parts of an antioxidant, 5...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention discloses high-precision nano soldering paste and a preparation method thereof, and particularly relates to the technical field of nano soldering paste preparation. Comprising the following components in parts by weight: 4-6 parts of soldering tin powder, 2-5 parts of an antioxidant, 5-15 parts of a binder, 4-10 parts of a diluent, 8-15 parts of an organic solvent, 1-3 parts of a water repellent, 1-3 parts of a stabilizer, 1-4 parts of dibutyl succinic acid sodium sulfonate, 3-8 parts of soldering flux, 6-16 parts of a cellulose solution, 1-3 parts of phenethyl phenol polyoxypropylene polyoxyether, 1-3 parts of a defoaming agent and 3-8 parts of a binding aid. The method is simple in process, low in equipment requirement and high in operability, air or impurities in the raw materials can be removed through pretreatment so as to improve the consistency and stability of the mixture, and various components in the solder paste are further fused and stabilized through aging treatment so as to improve |
---|