Preparation method of LED packaging structure and LED packaging structure

The invention relates to a preparation method of an LED packaging structure and the LED packaging structure. The preparation method of the LED packaging structure comprises the steps that a metal plate containing a plurality of hollow-out areas is provided, and the plurality of hollow-out areas are arranged on the metal plate in an array mode; the LED chip is plastically packaged in the hollow area of the metal plate; and manufacturing a conductive layer, a circuit layer and an anti-oxidation metal layer on the upper and lower surfaces of the metal plate. Compared with the prior art, a substrate which is tedious in manufacturing is not used, a metal plate is directly used, the manufacturing cost is low, the manufacturing period is short, and the production efficiency is high. Moreover, the metal plate has excellent flatness, the subsequent process is facilitated, the circuits on the upper surface and the lower surface can be flexibly designed, and the application range is wide. Besides, a bare chip IC chip or