Super capacitor shell and packaging structure thereof

The invention discloses a super capacitor shell. The shell is of a hollow cylinder structure formed by injection molding of a solid polymer resin-based material. The invention further discloses a packaging structure of the super capacitor shell. The packaging structure comprises a super capacitor st...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: BAI FENG, CHE JINGFENG, ZAN YAHUI, JIA SHAOBO, LIU QIONG
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!