Application of compound 8519-0065 in preparation of medicine for promoting skin wound healing

The invention discloses application of a compound 8519-0065 in preparation of a medicine for promoting skin wound healing, the molecular formula of the compound 8519-0065 is C26H25N5O2S, the structural formula of the compound 8519-0065 is # imgabs0 #, the compound 8519-0065 is used for preparing the...

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Bibliographische Detailangaben
Hauptverfasser: HOU JIAKANG, LI QINGFENG, LIU YANGDAN, GAO YA, ZHANG YIFAN
Format: Patent
Sprache:chi ; eng
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